Taiwan Semiconductor Manufacturing Comp. Ltd.

Kuan-Chi Huang

Chi-Shen Lo

The present invention provides a method for removing a coating layer of SOG or photoresist from a wafer flat side on a wafer by first injecting a flow of a cleaning solution at the bottom surface of the wafer at a location adjacent to the edge of the wafer, and then rotating the wafer at a rotational speed sufficiently high so as to cause the cleaning solution being pulled from the bottom side to the top side of the wafer by flowing around the edge to remove the coating layer covering the unintended area on the top surface of the wafer.

Growing community of inventors

Hsin-Chu, Taiwan

Kuan-Chi Huang