Aptiv Technologies Limited

Krzysztof Adamczyk

Grzegorz Szostek

Marcin Hyrlicki

Janusz Duralek

Pawel Brache

An electromagnetic compatibility (EMC) housing having a first part and a second part for forming an enclosure when fitted together. The first and second parts include first and second interface surfaces respectively, for compressing a gasket interposed between the interface surfaces when the first and second parts are fitted together. At least one of the first and second interface surfaces includes a plurality of undercut regions for reducing compression of the gasket in the region when the first and second parts are fitted together.

EMC housing

A heat dissipation device comprises a generally rectangular metal cooling plate; the metal plate comprises, on its upper face, first attachment means for attaching a first printed circuit board, which means are provided for bringing at least one heat-generating zone of the first printed circuit board to bear with the upper face of the plate; the metal plate comprises, on its lower face, second attachment means for attaching a second printed circuit board, which means are provided for bringing at least one heat-generating zone of the second printed circuit board to bear with the lower face of the plate.

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Zegocina, Poland

Krzysztof Adamczyk