Average Co-Inventor Count = 2.20
ph-index = 9
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Intel Corporation (18 from 54,781 patents)
18 patents:
1. 7691671 - Radiant energy heating for die attach
2. 7585693 - Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
3. 7209026 - Integrated package inductor for integrated circuit devices
4. 7187066 - Radiant energy heating for die attach
5. 7173329 - Package stiffener
6. 7154175 - Ground plane for integrated circuit package
7. 7131850 - Socket for a microelectronic component having reduced electrical resistance and inductance
8. 7064004 - Induction-based heating for chip attach
9. 7045890 - Heat spreader and stiffener having a stiffener extension
10. 6975518 - Printed circuit board housing clamp
11. 6877223 - Method of fabrication for a socket with embedded conductive structure
12. 6750551 - Direct BGA attachment without solder reflow
13. 6661660 - Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
14. 6639799 - Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
15. 6586684 - Circuit housing clamp and method of manufacture therefor