Micron Technology Incorporated

Kristopher D Hamrick

Bradley R Bitz

Mark A Tverdy

João Elmiro Da Rocha Chaves

James J Oleary

Methods, systems, and devices for circuit board structures for component protection are described. A memory system may be implemented on a circuit board, where one or more memory devices may be attached to the circuit board. Components for accessing the one or more memory devices may also be attached to the circuit board. The circuit board may also include one or more structures extending from the circuit board that are configured to shield the one or more memory devices, the components for accessing the one or more memory devices, or both, from forces.

Circuit board structures for component protection

A printed wiring board is disclosed, with a build-up lamination material comprising a die side and a land side; a recess in the build-up lamination material at the die side, the recess comprising a recess floor; a first wall orthogonal to the recess floor; a second wall orthogonal to the recess floor, the second wall spaced apart from and opposite the first wall; a first recessed contact pad including a first vertical portion substantially in the recess at the first wall; a second recessed contact pad including a second vertical portion substantially in the recess at the second wall; and electrical coupling structures within the build-up lamination material, the electrical coupling structures coupled to each of the first recessed contact pad and the second recessed contact pad.

Growing community of inventors

Boise, ID, United States of America

Kristopher D Hamrick