Apple Inc.

Kristina A Babiarz

Duncan Robert Kerr

Bartley K Andre

Richard P Howarth

Peter N Russell-Clarke

Martha Evans Hankey

Jeremy D Bataillou

Jonathan P Ive

Eugene Antony Whang

Jody R Akana

Julian Hoenig

Shota Aoyagi

Benjamin Andrew Shaffer

Molly J Anderson

Markus Peter Diebel

Clement Tissandier

Julian Jaede

Marine C Bataille

Anthony Michael Ashcroft

Mikael M Silvanto

Rico L Zorkendorfer

Florence W Ow

Melody L Kuna

Alex Chun Lap Yeung

Carli E Oster

Sung-Ho Tan

Carlo Catalano

Lee B Hamstra

Devin M Williams

Ross M Errett

Stephen Robert McClure

Storrs Townsend Hoen

Aidan N Zimmerman

Miguel C Christophy

Sinan Filiz

Romain A Teil

Vivek Katiyar

Eugene C Cheung

Thomas O Henry

Justin R Heckman

Kellen M Asercion

Hiroshi Kubo

Daniel J Coster

Abidur Rahman Chowdhury

Clara Geneviève Marine Courtaigne

Paul Xiaopeng Wang

Nicolas Pedro Lylyk

Moises Hernandez Hernandez

John Raff

Jeremy C Franklin

Kainoa Kwon-Perez

Alexandre B Girard

Anne-Marie Heck

Sean S Corbin

Yinjuan He

Matin Seadat Beheshti

Kristine S Atom

Jessica L Ong

Christopher J Stringer

Daniele De Iuliis

Matthew Dean Rohrbach

Shin Nishibori

Marc A Newson

Jonathan Gomez Garcia

Joe Sung-Ho Tan

Rico Zörkendörfer

Phillip Michael Hobson

Matthew S Rogers

Li Zhang

Dale N Memering

Derek William Wright

Kevin David Gibbs

Amy Qian

Ivan S Maric

Carl R Peterson

Forrest C Wang

Sivesh Selvakumar

Avery P Yuen

Jonathan M Lee

Sina Bigdeli

Jan K Quijalvo

Di Liu

Blake N Trekell

Stephen C Cool

Noell G Johnson

Ming Leong

Shirley S Lu

Sean M Grove

Matin Sedat Beheshti

Display module for head-mounted display

Housing portion for head-mounted display

An electronic assembly includes a printed circuit board (PCB), an electronic component coupled to the PCB, an electrically conductive fence coupled to the PCB and surrounding a perimeter of the electronic component, and a fan assembly. The fan assembly includes a housing coupled to the fence and disposed over the electronic component and a plurality of fan blades configured to rotate within the housing.

Head mountable display

Housing module for an electronic device

A head-mountable display device can include a structural frame, where a first mounting bracket can be coupled to a first side of the structural frame. In some examples, the first mounting structure can include a cantilever arm. A second mounting bracket can be coupled to a second side of the structural frame opposite the first side, where the second mounting bracket can include a mounting arm, a sensor coupled to the cantilever arm, and a display assemble slidably coupled to the mounting arm.

A head mountable display device can include a frame defining an aperture, an optical assembly disposed in the aperture, and a curtain assembly extending between the frame and the optical assembly and occluding the aperture. The curtain assembly can include an elastic layer and an air-impermeable layer.

A head mountable display can include a structural frame, an optical bracket coupled to the structural frame, an optical assembly adjustably secured to the optical bracket, the optical assembly including a display screen, and a stop mechanism extending from the structural frame. The optical assembly can move back-and-forth between the optical bracket and the stop.

Display for an electronic device

An electronic device may have a display cover layer provided with an infrared-transparent antireflection coating. A pixel array may emit visible light through the cover layer and the coating. An infrared emitter may emit infrared light and an infrared sensor may receive infrared light through the coating and the cover layer. The coating may include a stack of thin-film interference layers. The stack may include alternating lower and higher refractive index layers. The layers may have thicknesses and materials that configure the coating to exhibit an infrared transmittance of greater than 94% from 920 nm to 960 nm and a photopic reflectance of less than 1.5%. The coating may reflect visible light to prevent displayed images from being obscured by visible reflections. At the same time, some photopic reflectance of the coating may be sacrificed to maximize infrared transmittance and accommodate operation by the infrared emitter and sensor.

Electronic devices having infrared-transparent antireflection coatings

Component for an electronic device

Growing community of inventors

San Jose, CA, United States of America

Kristina A Babiarz