Rockwell Automation Technologies Incorporated

Kristin N Yee

Michael J Melfi

Zoran Vrankovic

Arun K Guru

Zhenhuan Yuan

John Balcerak

David A Figie

Brijeshkumar Meghpara

Piotr Hilary Krawiec

Barbara Grosek

John A Balcerak

Power semiconductor switching devices in an integrated motor drive are mounted directly to a circuit board substrate via a 'pick and place' assembly process. The circuit board substrate is then mounted within the housing for the integrated motor drive and, preferably, in a generally central orientation within the housing. A potting material is provided within the housing of the integrated motor drive and around the circuit board. The potting material substantially encloses the circuit board and fills the volume within the integrated motor drive. The potting material is selected to provide good thermal conductivity between the circuit board and the housing of the integrated motor drive. The potting material is also selected to provide flexibility such that expansion and contraction of the potting material due to heating and cooling of the material does not damage the circuit board or the electronic components mounted to the circuit board.

System and method for cooling switching devices in an integrated motor drive

The present disclosure includes drive modules for motor-drive assemblies of an industrial automation system. The drive modules may include a housing having a cavity and may also include power circuitry and control circuitry. The power circuitry may convert input DC power to three-phase controlled frequency AC power and may supply the three-phase controlled frequency AC power to a motor. The control circuitry may apply control signals to control operation of the motor. The drive module may also include an adapter that couples to a first end of the housing and couples the housing to the motor. The adapter may be removable and sized according to a frame size of the motor such that the drive module is compatible with the motor. The housing may be independent of the frame size of the motor. As such, the housing may be interchangeable for any motor frame size and/or motor power.

Drive module for motor-drive systems

A cooling system is provided for power conversion circuitry. An intake section of a cooling air channeling element is arranged to direct cooling air through an enclosure, and through or around system components to circuit board-mounted circuitry to be cooled. The element has internal structures, such as deflectors that create local pockets of lower velocity and/or higher pressure air to trap airborne particles that can be evacuated through apertures (e.g., in adjacent plates or mounting structures). The intake section leads to a distribution section that is positioned adjacent to the circuit components to be cooled. The element may have an open bottom that cooperates with surrounding structures to channel the cooling air, facilitating molding of a single-piece element that can be easily mounted during system assembly.

Power conversion equipment cooling with cyclonic airborne particle reduction

A motor having a circuit board including at least two MEMS sensors. The circuit board is mounted within a housing of the motor using the same fasteners as an encoder of the motor. Mounting the MEMS sensors to the circuit board simplifies assembly of the motor and standardizes the positioning of the MEMS sensors within the housing, while the overall motor footprint is unaffected.

Board mounted microelectromechanic system (MEMS) sensors for motor diagnostics and analytics

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Mequon, WI, United States of America

Kristin N Yee