Intel Corporation

Kristin L Weldon

Barrett M Faneuf

Aleksander Magi

David Shia

Ralph V Miele

Jered H Wikander

Jin Yang

Weibo Chen

Michael S Brazel

Richard Paul Crawford

Konstantin I Kouliachev

Lily Kolle

Jun Zhang

Damion T Searls

Mark E Sprenger

Richard J Dischler

Devdatta P Kulkarni

Eric W Buddrius

Mohanraj Prabhugoud

Bijoyraj Sahu

Kenan Huseyin Arik

Prabhakar Subrahmanyam

Catharina Biber

Joseph Andrew Broderick

Michael Berktold

Ying-Feng Pang

Yi Xia

Carlos Alvizo Flores

Brendan T Pavelek

Jimmy Chuang

Victor Polyanko

Minh T D Le

Annie Chen

Yuyang Xia

Javier Avalos Garcia

Lianchang Du

Mark Bianco

David Rodriguez

Yuehong Fan

Luz Karine Sandoval Granados

Adriana Lopez Iniguez

Jessica Gulbrand

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Yuan Li

Hemant Desai

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.

Technologies for liquid cooling interfaces

An apparatus is described. The apparatus includes an electronic component to be plugged into an electronic system. The electronic component includes a housing. The housing includes a jam. The jam is to push through a first opening in a bottom of the housing and a second opening in a surface when the first and second openings are at least partially aligned. The surface is a mechanical component of the electronic system that the electrical component is to slide upon when being plugged into the electronic system. The jam includes tooth edges to engage with an edge of the second opening.

Jam for integration reliability of ruler form factor component

Techniques for forming and adjusting a magnetic tension mechanism are described herein. A system includes a first magnetic element in a first component of a computing device. The system includes a second magnetic element in a second component of the computing device, wherein the first magnetic component and the second magnetic component are to be held in tension by a magnetic force. The system also includes an adjustment mechanism to adjust the force required to decouple the magnetic elements.

Adjustment of magnetic force in a computing device

Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

Mechanism with folded wrapping to seal components immersed in coolant

Growing community of inventors

Dupont, WA, United States of America

Kristin L Weldon