Texas Instruments Corporation

Kristen Nguyen Parrish

Charles Allen DeVries

Charles Devries

Yuki Sato

Jonathan Almeria Noquil

Jeffrey Anthony Morroni

Roberto Giampiero Massolini

Joyce Marie Mullenix

Kenji Otake

Joel Nathan Brassfield

Takafumi Ando

Kyle Brent Norell

Osvalod Jorge Lopez

A molded inductor includes a winding having leads configured for attaching leads of the winding to pads on a package substrate, having a magnetic core with a body disposed within the winding, wherein the magnetic core has at least one mold flow enhancing feature that enhances a filling of a magnetic mold material as compared to a filling provided by a uniform cylindrical body. The magnetic mold material encases the winding and the magnetic core to form either a standalone discrete inductor component, or the magnetic component of an output filter of an integrated switching power converter module.

Molded inductor with magnetic core having mold flow enhancing channels

A device includes a circuit assembly and a first conductive winding support having a first end attached to the circuit assembly and having a first winding support surface a first distance from the circuit assembly. The device also includes a second conductive winding support having a second end attached to the circuit assembly and having a second winding support surface a second distance from the circuit assembly, the second distance being different than the first distance. A conductive winding has first and second winding ends. The first winding end is attached to the first winding support surface, and the second winding end is attached to the second winding support surface.

Leadframe for conductive winding

An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

Integrated circuit

A method for manufacturing a switch-mode converter includes forming a plurality of windings by coiling one or more conductors. Each of the windings is secured to one of a plurality of module bases arranged in a module array. At least one side of the array is encapsulated in a magnetic mold compound.

Switch-mode converter module

One example includes a device that is comprised of a die, a leadframe, and an electrically conductive material. The die includes a circuit therein. The leadframe is coupled with the die and the circuit therein. The electrically conductive material is disposed in a space above the die opposite the leadframe, the electrically conductive material being coupled to the leadframe and configured as one or more turns thereof to form at least one inductor.

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Dallas, TX, United States of America

Kristen Nguyen Parrish