Sgs-thomson Microelectronics Limited

Stmicroelectronics Gmbh

Krishnan Kelappan

Michael J Hundt

Harry Michael Siegel

Tom Q Lao

Frank J Sigmund

Haibin Du

Tom Quoc Lao

Mike Hundt

An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.

Integrated circuit package including embedded thin-film battery

A battery pack for two 2032 batteries includes a molded plastic base having an upper surface on which the batteries are received and columnar standoff posts projecting from a bottom surface, as well as a molded plastic housing sized to receive the batteries and an upper portion of the base and having ears through which screws are passed to be received by press-fit threaded inserts mounted on an integrated circuit packaging substrate and tightened to a predetermined torque. Like terminals of the batteries are joined by a welded plate, with conductive pins connected to each plate extending through the base and projecting from a bottom surface of the battery pack. A mounting guide ensures connection of proper pins to corresponding receptacles of an integrated circuit packaged during mounting of the battery pack on the integrated circuit packaging substrate.

BGA memory module with battery pack

A molded integrated circuit package system of the type suitable for surface mounting is disclosed. The system includes a chip package having leads along its sides that are of the surface-mountable type, and having a plurality of connectors at its ends. A module is provided which contains components that are sensitive to solder temperatures or the chemicals used in the soldering process; examples of such components include batteries and quartz crystal resonators. The components may be disposed directly over the chip package or, in order to reduce the height of the package system, one or both of the components may be disposed outside of the outline of the chip package. The module has connectors extending therefrom that mate with the connectors on the chip package, such that the module may be removably connected to the chip package after the surface mounting of the chip package to a circuit board. Mechanical connection may be provided by snap members extending from the module which engage surfaces of the chip package when mounted thereto. Lockout tabs are provided on the chip package and the module to prevent improper mounting and electrical connection.

Surface mountable integrated circuit package with low-profile detachable

A molded integrated circuit package system of the type suitable for surface mounting is disclosed. The system includes a chip package having leads along its sides that are of the surface-mountable type, and having a plurality of connectors at its ends. A module is provided which contains components that are sensitive to solder temperatures or the chemicals used in the soldering process; examples of such components include batteries and quartz crystal resonators. The module has connectors extending therefrom that mate with the connectors on the chip package, such that the module may be removably connected to the chip package after the surface mounting of the chip package to a circuit board. Mechanical connection may be provided by snap members extending from the module which engage surfaces of the chip package when mounted thereto. Lockout tabs are provided on the chip package and the module to prevent improper mounting and electrical connection.

Surface mountable integrated circuit package with detachable module

According to the present invention, a system for placing surface mount components on a planar PCB has a placement apparatus which picks up a surface mount component to be placed on the PCB and moves it along the x and y axes to the desired PCB component location. The placement apparatus then moves a predetermined vertical distance towards the PCB. Next, a contact apparatus of the system having a spring bias force moves in a vertical direction towards the PCB until it makes contact with the PCB at a location in close proximity to the PCB component location. The contact apparatus has a spring bias force which holds the PCB planar at the PCB component location so that the surface mount component may be placed on the PCB.

Apparatus for achieving printed circuit board planarity

A packaged integrated circuit and method of manufacturing the same is disclosed. The semiconductor integrated circuit chip is mounted and bonded to a lead frame in the conventional fashion, and an inner molded body is formed therearound. The leads of the lead frame have inner and outer dambars, with the inner dambars located so as to prevent bleedout of mold compound during the molding of the inner body. Upon removal of the inner dambars, two tie bars become floating and are then formed to extend above the inner molded body so as to make contact to an electrochemical cell that is attached to the inner molded body. An outer body is then molded to surround the inner molded body and the cell, with the outer dambars located so as to prevent bleedout of mold compound. Removal of the outer dambars and formation of the leads into the desired shape completes the assembly of the packaged integrated circuit. A molded integrated circuit package including both the integrated circuit together with a battery for backup or primary power is thus provided.

Molded package integrated circuit with electrochemical cell

Socketed integrated circuit package

Detachable integrated circuit module

Low-profile detachable integrated circuit module

An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.

Growing community of inventors

Carrollton, TX, United States of America

Krishnan Kelappan