International Business Machines Corporation

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International Business Corporation

Krishna Gandhi Sachdev

Harbans S Sachdev

Glenn A Pomerantz

John Ulrich Knickerbocker

Keith S Pennington

Mitchell S Cohen

James N Humenik

Chon Cheong Lei

Michael Berger

Umar M Ahmad

Charles Hampton Perry

Daniel George Berger

Daniel S Mackin

Bruce E Tripp

Ali Afzali-Ardakani

Govindarajan Natarajan

Ranee W Kwong

Candace A Sullivan

Michael E Cropp

Donald W Diangelo

James C Utter

John F Harmuth

Joel R Whitaker

David E Speed

Kelly May Chioujones

David Clifford Long

Hilton T Toy

Sushumna Iruvanti

Glenn Graham Daves

Peter Jerome Sorce

Robert Neal Lang

Mark S Chace

Vincent P Peterson

Jon Alfred Casey

Ari Aviram

Anson Jay Call

Richard Francis Indyk

John Patrick Hummel

Gregg B Monjeau

Robert J Sullivan

Herbert R Anderson, Jr

John T Butler

Kathleen Mary McGuire

Abubaker S Shagan

Benedikt Maria Kellner

Keith Scott Olsen

Ratnam Sooriyakumaran

Jeffrey Donald Gelorme

Mark J LaPlante

Thomas Anthony Wassick

Mahmoud M Khojasteh

Frank Louis Pompeo

Subhash Laxman Shinde

Lester W Herron

David Lewis Gardell

Shaji Farooq

Thomas Edward Lombardi

Lawrence D David

Robert Anthony Rita

Donald Rene Wall

Raymond A Jackson

Brian W Quinlan

David B Goland

Patrick Anthony Coico

Robert William Pasco

Robert W Nufer

Thomas J Walsh

Arthur Bross

Richard D Kaplan

Constance J Araps

Robert O Lussow

Dale Curtis McHerron

Brian H Desilets

Renuka S Divakaruni

Robert D Johnson

Leo L Linehan

John C Shen

Kathleen M Wiley

Premlatha J Jagannathan

Daniel P Kirby

Abbas Behfar-Rad

Rebecca Yung Gorrell

Donald E Myers

Normand Cote

Amy B Ostrander

Darbha Suryanarayana

Megan J Shannon

Joseph D Peruffo

Stephen Anthony Shear

Sundar Mangalore Kamath

James R Lyerla, Jr

Hsing Hsiung Chen

Demian M Riccardi

Bernadette H Perry

Kathleen Mary Mc Guire

Benedikt Maria Johannes Kellner

Felice J Mancaruso

Gerard V Capogna

Frank Louis Pompeo Jr

Richard A Cormack

Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.

Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly

A method to repair ceramic substrates is disclosed using a novel polyimide polymer which has high thermal stability, resistance to fluxes and flux residue cleaning solvents and processes, good mechanical properties, good adhesion to all contacting surfaces with low moisture uptake and good flow properties suitable for repairing chipped ceramic, filling deep trench or vias and writing passivation lines with automated process The polyimide polymer is made by reacting aromatic dianhydride and aromatic diamine monomers with a stoichiometric offset and end capping the resulting polymer when the reaction is completed. The preferred polyimide is made using a molar excess of diamine which is end-capped using an anhydride.

Polyimide compositions and use thereof in ceramic product defect repair

A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

Conductive adhesive composition

A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Conductive adhesive rework method

Solvent-free UV-curable polymer materials derived from miscible blends of reactive organic monomeric, oligomeric and low molecular polymeric systems and organic and inorganic fillers such as polytetrafluoroethylene and talc are provided to form polymer-filler composite compositions for use in the fabrication and repair of electronic components and microelectronic assembly processes. The composition contains a preformed thermoplastic or elastomeric polymer/oligomer with reactive end groups, a monofunctional and/or bifunctional acrylate monomer, a multifunctional (more than two reactive groups) acrylated/methacrylated monomer, a photoinitiator and a fluorocarbon polymer powder as an organic filler which is preferably PTFE and an inorganic filler such as talc. A nano-filler may also be used as the inorganic filler alone or in combination with another inorganic filler such as talc. A method is also provided for repairing defects on ceramic substrates using the composition of the invention or other curable polymeric compositions.

UV-curable solvent free compositions and use thereof in ceramic chip defect repair

A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Thermal interface adhesive and rework

A semi-aqueous solvent based method using non-aromatic, halogen-free organic solvent compositions for the effective removal of flux residue from electronic component surfaces after high temperature solder interconnections in the presence of rosin based flux compositions. Rosin flux residue can be removed using hydrophobic, essentially water insoluble, propylene glycol alkylether solvents in conjunction with a surfactant, preferably an ionic and/or a mixture of a non-ionic and an ionic surfactant in the first step, then a second step involving immersion with agitation in a hydrophobic solvent with no added surfactant. This is followed by a third step of hydrophilic solvent immersion with agitation/spray, rinsing off the hydrophilic solvent with water, and then a drying step.

Semi-aqueous solvent based method of cleaning rosin flux residue

A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.

Semi-aqueous solvent cleaning of paste processing residue from substrates

Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; for defect repair in ceramic and thin film products by micropassivation in high circuit density electronic modules to allow product recovery; as a solder mask in electronic assembly processes; for use as protective coatings on printed circuit board (PCB) circuitry and electronic devices against mechanical damage and corrosion from exposure to the environment. The compositions are solvent-free, radiation-curable, preferably uv-curable, containing a polymer binder, which is a pre-formed thermoplastic or elastomeric polymer/oligomer, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent. The compositions may also contain inorganic fillers and/or nanoparticle fillers.

UV-curable compositions and method of use thereof in microelectronics

A method of removing cured silicone polymer deposits from electronic components. The components are immersed in a preheated solution of a quaternary ammonium fluoride in a hydrophobic non-hydroxylic aprotic solvent with agitation. The components are then immersed in a preheated solvent consisting essentially of a hydrophobic aprotic solvent with agitation. This is followed by a rinse and spray of the components with a hydrophilic, essentially water soluble solvent, with agitation. The components are then immersed in a water bath and then rinsed with a pressurized spray of water and then dried with a N blow dry.

Method of removing silicone polymer deposits from electronic components

This invention relates to water-based alkaline cleaning solutions and their use as an environmentally safer replacement of organic solvents to remove photoresist, polyimide residue and other interlevel dielectric polymer coating residue from polymer film apply equipment, specifically, spin coater bowl and assembly parts consisting of a teflon top shield, stainless steel plate, and a bottom teflon spin coating bowl used in semiconductor device fabrication processes.

Aqueous cleaning of polymer apply equipment

This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface. After lamination the thermally depolymerizable/decomposable film is conveniently and cleanly removed due to thermal depolymerization and burn-off of volatile species during the sintering process, thus providing surface defect-free ceramic substrates.

Method of forming defect-free ceramic structures using thermally depolymerizable surface layer

The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85&deg; C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/&deg;C. at 100&deg; C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.

Polymer and ceramic composite electronic substrates

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Hopewell Junction, NY, United States of America

Krishna Gandhi Sachdev