Akash Systems, Inc.

Kris Kong

Daniel Francis

Felix Ejeckam

Paul Saunier

Tyrone D Mitchell, Jr

Aspects of wireless communication are described, including a radiofrequency (RF) amplifier chip, configured for transmitting or receiving data, comprising a first substrate comprising a first material and a second substrate comprising a second material that is different from the first material. The first substrate and the second substrate may be lattice-matched such that an interface region between the first substrate and the second substrate exhibits an sp3 carbon peak at about 1332 cm&#xb7;having a full width half maximum of no more than 5.0 cm&#xb7;as measured by Raman spectroscopy. In some aspects, the first substrate and said second substrate permit said chip to transmit or receive data at a transfer rate of at least 500 megabits per second and a frequency of at least 8 GHz. In some aspects, the RF amplifier chip is part of a satellite transmitter.

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San Francisco, CA, United States of America

Kris Kong