Nihon Dempa Kogyo Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Yamata Scale Co., Ltd.

Kozo Ono

Kuichi Kubo

Fumio Asamura

Takahiro Inoue

Toshiaki Takeuchi

Akio Chiba

Minoru Ishihara

Kunio Hamaguchi

Takehiro Takahashi

Kazuo Akaike

Akihiro Nakamura

Shingo Kawanishi

Minoru Fukuda

Motoo Takada

Masahiro Yoshimatsu

Noritoshi Kimura

Tamotsu Kurosawa

Takaaki Ishikawa

Takaaki Ishii

Takeo Oita

Nobuo Tsukamoto

Jiro Terada

Junichi Yukawa

Masami Yamanaka

Tsutomu Yamakawa

Motoyuki Adachi

Kazumasa Adachi

Makoto Okamoto

Nobuo Hiruma

Takuji Yamamoto

Kuniharu Nakamaru

Takaharu Fukushima

A Geiger-Muller counter tube includes a cylindrical enclosing tube, an anode electrode, a cylindrical cathode electrode, an inert gas, and a quenching gas. The cylindrical enclosing tube has a sealed space. The anode electrode is disposed inside the space and formed in a rod shape. The cylindrical cathode electrode surrounds a peripheral area of the anode electrode inside the space to have an opening. The inert gas and the quenching gas are sealed inside the space. At least one of the anode electrode and the cathode electrode includes a plurality of electrodes inside the enclosing tube.

Geiger-Muller counter tube and radiation measurement apparatus

A Geiger-Muller counter tube includes an enclosing tube, an anode conductor, a cathode conductor, an inert gas, and a quenching gas. The enclosing tube is at least partially cylindrical and has a sealed space. The anode conductor includes an anode electrode and a linear first metal lead portion. The anode electrode is arranged inside the space and formed in a rod shape. The first metal lead portion is connected to the anode electrode and supported at an end of the enclosing tube. The cathode conductor includes a cylindrical cathode electrode and a linear second metal lead portion. The cathode electrode surrounds a peripheral area of the anode electrode inside the space. The second metal lead portion is connected to the cathode electrode and supported at the end of the enclosing tube. The cathode electrode has a side surface through a part of which a through-hole passes.

A radiation measurement apparatus for measuring radiation includes a first and second Geiger-Muller counter tubes and a radiation-direction calculating unit. The first Geiger-Muller counter tube seals an electrode within a circular pipe-shaped enclosing tube that extends in a straight line. The first Geiger-Muller counter tube is arranged along a first direction. The second Geiger-Muller counter tube seals an electrode within a circular pipe-shaped enclosing tube that extends in a straight line. The second Geiger-Muller counter tube is arranged in a second direction intersecting with the first direction. The radiation-direction calculating unit is configured to compare a first detection signal and a second detection signal with one another to calculate a direction of radiation to be emitted from the sample. The first detection signal is output from the electrode of the first Geiger-Muller counter tube. The second detection signal is output from the electrode of the second Geiger-Muller counter tube.

Radiation measurement apparatus

In an exemplary method for manufacturing a piezoelectric device, a lid wafer, a piezoelectric wafer, and a base wafer are prepared. Each wafer defines multiple lids, multiple piezoelectric vibrating pieces, and multiple bases, respectively. The piezoelectric vibrating pieces comprise respective first and second electrodes, and the base wafer is made of glass. The bases comprise respective first and second metal wires extending therethrough, each wire having a respective end and a respective side surface at the end that protrudes at least partially from the first surface. A wafer sandwich is formed with the three wafers co-aligned with each other, with the protruding ends of the wires contacting respective first and second electrodes. The layers are anodic bonded together, which also bonds the protruding ends of the first and second wires to the respective first and second electrodes. The bonded wafer sandwich is cut into separate individual piezoelectric devices thus formed in the sandwich from each other.

Methods for manufacturing piezoelectric devices

Piezoelectric devices and method for making them are disclosed. An exemplary piezoelectric device has a package base defining a cavity on a first surface thereof. An opposing second surface of the package base has at least one through-hole, a mounting electrode on which a piezoelectric vibrating piece is attached, and a respective sealing electrode sealing each through-hole. At least one external electrode is on the second surface, and a lid is bonded to the package base to enclose the piezoelectric vibrating piece. The mounting electrode, sealing electrodes, and external electrodes are formed integrally.

Piezoelectric devices and methods for manufacturing same

An optical filter is provided having an optical plate which has a chamfered section formed on an outer peripheral edge section of one principle surface of the optical plate and has isotropy with respect to wet-etching. The chamfered section is of an arc shape which is cross-sectionally concave in an inward direction of the optical plate.

Optical filter

To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof. Buffer layers made of an amorphous inorganic substance causing a brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from one another, and the substrates to be bonded are stacked so that the buffer layers are faced to each other. Then, a heat treatment is performed for a stack, and thereby direct bonding via an atom is formed between the buffer layers.

Method of manufacturing optical component and optical component

Crystal unit

Devices are disclosed that include a piezoelectric vibrating piece; a glass base and lid form a package enclosing the piezoelectric vibrating piece. The piece has first and second electrodes. The base has first and second opposing surfaces. The base mounts the piezoelectric vibrating piece, and the lid seals the piezoelectric vibrating piece in the package. The base includes first and second metal wires, extending therethrough, whose ends are denuded to the first and second surfaces and connected to the first and second electrodes, respectively. In disclosed methods for making the packaged devices, such as piezoelectric oscillators, multiple packaged devices are made simultaneously by stacking and simultaneously bonding respective wafers on which glass bases, piezoelectric vibrating pieces, and lids have been formed.

Piezoelectric devices and associated fabrication methods are disclosed. An exemplary piezoelectric device includes a piezoelectric vibrating piece having first and second electrodes and first and second surfaces, a glass base having first and second surfaces, and a lid. These three parts also form the device package. The first surface of the piezoelectric vibrating piece is mounted to the base, and the lid is mounted to the second surface of the piezoelectric vibrating piece to seal the package. The glass base includes first and second metal wires having ends that protrude from the surfaces of the base. The side surfaces of the protruding wire ends are connected to the first and the second electrodes, respectively. Manufacture is performed using whole wafers that are processed, sandwiched, bonded, and then cut to produce individual devices.

A high-frequency wireless communication device is provided that is capable of enlarging the range of communication by enhancing reception sensitivity while avoiding mutual interference. The device comprises an antenna filter and a direct detection type reception mechanism connected to the antenna filter. A crystal filter is used as the antenna filter. A crystal chip constituting the crystal filter and an IC chip into which the reception mechanism is integrated are housed in a single modular container to configure a high-frequency wireless module.

High-frequency radio apparatus

A stacked crystal unit includes: a first crystal plate in which a vibration member links to an outer circumferential frame portion, and a pair of extending electrode extends to the frame portion from excitation electrodes; and a second and third crystal plates which have a concave portion in an area opposite to the vibration member and whose open end surfaces are joined by direct bonding to both principal surfaces of the frame portion in the first crystal plate. The extending electrodes are electrically extended to an outer surface of at least one of the second and third crystal plates via electrode through-holes provided in the frame portion. The electrode through-hole includes: a first electrode through-hole penetrating through the frame portion from the principal surface of the frame portion where the extending electrode extends; and a second electrode through-hole provided in the second or third crystal plate.

Crystal unit having stacked structure

A temperature-compensated crystal oscillator for surface mounting wherein an IC chip into which is integrated a temperature-compensated device having an oscillating circuit and a temperature sensor, which supplies a compensation voltage to a variable-voltage capacitor element of the oscillating circuit, and which also has IC terminals disposed along two edges comprising at least diagonally opposite corner portions of one main surface that acts as a circuit function surface is affixed with the use of bumps to an inner base surface of a main container that is concave in section, and one edge portion of a crystal piece is affixed to an inner wall step portion of the main container; wherein an active element of the oscillating circuit that acts as a heat source and a temperature sensor of the temperature-compensated device are disposed at diagonally opposite corner regions of the IC chip at the greatest distance apart. In addition, IC terminals for thermal dissipation are provided in a central region of the IC chip. The present invention provides a temperature-compensated oscillator for surface mounting in which the temperature-compensation operation at startup is satisfactory and frequency stability is maintained.

Surface mount type temperature-compensated crystal oscillator

The crystal oscillator device for simultaneously generating oscillator signals with a plurality of oscillation modes of a crystal unit, comprising: a primary resonator unit filtering the oscillator signal with a primary oscillation mode, which is one of the oscillation modes, from the output of the crystal unit, a secondary resonator unit filtering the oscillation signal, bearing a different resonance frequency from that of the primary resonator unit, with the primary oscillation mode from the output of the crystal unit, a primary phase synthesis unit, synthesizing the phases of the output signal of the primary resonator unit and the output signal of the secondary resonator unit, a tertiary resonator unit, a quaternary resonator unit, and a secondary phase synthesis unit.

Growing community of inventors

Saitama, Japan

Kozo Ono