Dowa Electronics Materials Co., Ltd.

Dowa Mining Co., Ltd.

Kozo Ogi

Kenichi Inoue

Atsushi Ebara

Masahiro Yoshida

Takatoshi Fujino

Hiroshi Matsushima

Takahiro Yamada

Kimitaka Sato

Toshihiko Ueyama

Yutaka Hisaeda

Yoshiyuki Michiaki

Taku Okano

Yuki Kaneshiro

Hideyuki Fujimoto

Akihiro Asano

Kyoso Masuda

Yuto Hiyama

An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.

Silver-coated alloy powder, electrically conductive paste, electronic part, and electric device

To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 &#x3bc;m to 10 &#x3bc;m, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.

Silver-bismuth powder, conductive paste and conductive film

A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (Ddiameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 &#x3bc;m), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.

Silver-coated copper alloy powder and method for producing same

After a reducing agent is added to a water reaction system containing silver ions to deposit silver particles by reduction, the silver particles are dried to obtain a silver powder which is heat-treated at a temperature of higher than 100&#xb0; C. and lower than 400&#xb0; C. The silver powder thus heat-treated has a maximum coefficient of thermal expansion of not greater than 1.5% at a temperature of 50&#xb0; C. to 800&#xb0; C., and has no heating peak when the silver powder is heated from 50&#xb0; C. to 800&#xb0; C. The silver powder has an ignition loss of not greater than 1.0% when the silver powder is ignited until the weight of the silver powder is constant at 800&#xb0; C. The silver powder has a tap density of not less than 2 g/cmand a BET specific surface area of not greater than 5 m/g.

Silver powder and method for producing same

A silver particle dispersion liquid comprising a silver particle powder having an average particle diameter (D) of 50 nm or less, the surface of the particle being covered with an organic protective material, dispersed in a non-polar or small polar liquid organic medium having a boiling point of 60 to 300&#xb0; C., wherein the organic protective material is an amine compound having one or more unsaturated bonds in one molecule. The silver particle dispersion liquid can be produced by reducing a silver compound in a liquid including one or more alcohol or polyol acting as a reducing agent, wherein the reduction reaction is conducted in the presence of an amine compound having a molecular weight of 100 to 1,000 and having one or more unsaturated bonds in one molecule.

Silver particle dispersion ink

There is provided a method for producing a silver powder having excellent dispersibility and capable of forming a paste which do not form suspended matters by phase separation and which is printed on a substrate to form a film having a uniform thickness. In this method, an alkali or a complexing agent is added to an aqueous silver salt containing solution to form a silver oxide containing slurry or an aqueous silver complex salt containing solution. After or before silver particles are deposited by reduction by adding a reducing agent to the silver oxide containing slurry or aqueous silver complex salt containing solution while stirring it, at least one chelating agent selected from the group consisting of compounds having an azole structure, dicarboxylic acids, hydroxy carboxylic acids and salts thereof is added to a silver power containing slurry solution as a dispersing agent.

Silver powder

Growing community of inventors

Honjo, Japan

Kozo Ogi