Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Kozo Odawara

Shinjiro Tsuji

Takahiko Murata

Shingo Yamada

Ryouichirou Katano

Kazunori Ishikawa

Takashi Nakamura

Masashi Matsumori

Atsushi Katayama

Keiji Fujiwara

Masayuki Ida

Yuichi Takakura

A part feeding device of the present disclosure includes a main body; a conveyor; and a part detector. At a position further upstream than the part detector, the transporting passage includes a guide surface for guiding the lower surface of the part feeding tape, and a ceiling surface which faces the guide surface and is positioned at a position upwardly apart from the guide surface by the dimension larger than the thickness of the part feeding tape having the maximum thickness to be used in the part feeding device. The transporting passage includes a partial guide surface which supports the lower surface of the part feeding tape, and the partial guide surface includes an approaching portion approaching a ceiling surface in a downstream direction.

Part feeding device and part mounting apparatus

The pressing tool and the ACF tape cutting device are linked and connected with each other by a link device, and the forcing member is caused to move relatively towards and away from the knife member by lifting up and down the pressing tool so as to form a cut. By allowing the tool lifting device to double as a drive device for causing the forcing member to move relatively towards and away from the knife member, the necessity of the actuator of the ACF tape cutting device which is needed in the related art tape adhering device can be obviated.

Tape adhering device and tape adhering method

A tape adhering apparatus and a tape adhering method for adhering an ACF tape formed from an anisotropic conductive film to a target adhering area on a substrate are disclosed. It is an objective of the invention to provide a tape adhering apparatus and a tape adhering method that enable shortening of a time consumed by operation for adhering one cut piece of an ACF tape. According to the present invention, the separator is peeled from the cut piece of the ACF tape by letting the tape conveyor means convey the tape member in synchronism with the transfer action of the transfer base and thereafter a cut portion of the ACF tape to be next adhered is placed at the cutting position of the tape cutting means by letting the tape conveyor means continually convey the tape member in the forward conveyance direction.

Tape adhering apparatus and tape adhering method

A tape applying device for applying electrically conductive tape onto a board includes: a applying head for pressing the conductive tape; a tape holding unit including a reel section having a feed reel for feeding the conductive tape laminated with a separator and a wind-up reel to which the separator is to be wound up, and a tape guide section for guiding the conductive tape along with the separator to a position of pressing by the applying head; and a base section which has a tape guide driving unit for moving up and down the tape guide section, and to and from which the tape holding unit is fittable and removable. The tape guide section, while in a fitted state of being fitted to the base section, is separated from the reel section and moved up and down by driving force of the tape guide driving unit.

Tape applying device, tape holding unit, and tape applying method

Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes () each having an ACF (), and includes: a first holding unit that holds one of the ACF tapes (); a second holding unit that holds the other one of the ACF tapes (); a positioning unit () that positions the ACF tapes () to be overlapped in a thickness direction; and a pressing unit () that presses the overlapped ACF tapes () in the thickness direction.

Tape splicing apparatus and attaching apparatus

An apparatus for applying adhesive sheets includes a sheet applying base which is placed on a placement base so as to be withdrawable from the placement base and which has a sheet applying region to which adhesive sheets positioned closely before and after a junction portion are to be applied. In the sheet applying base, an upstream-side end portion of the sheet applying region in the adhesive sheet feed direction is placed so as to confront an end portion of the sheet applying head, and moreover a sheet escaping space opened downward is set in place.

Apparatus and method for applying adhesive sheet

A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.

Method for transferring a substrate

The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Growing community of inventors

Osaka, Japan

Kozo Odawara