Teikoku Tsushin Kogyo Co., Ltd.

Nippon Telegraph and Telephone Corporation

Teikoku Tsuhin Kogyo Co., Ltd.

Kozo Morita

Nobuyuki Yagi

Shinji Mizuno

Yasutoshi Kaku

Jiroh Inagaki

Nobuyuki Kikuchi

Osamu Nomura

Naoki Fukuda

Shinichi Suzuki

Takashi Shinoki

Osamu Kagami

Jiro Inagaki

Kazuji Watanabe

Shigeaki Kinoshita

Daisuke Makino

Akiko Yamanaka

Katsuyuki Tame

Koji Mitsui

Katsutoshi Yanoshita

Kazutaka Nakagome

Yosutoshi Kaku

An electronic component substrate (-) includes an insulating base () and a flexible circuit board () mounted on the insulating base (). The flexible circuit board () is a synthetic resin film provided thereon with terminal patterns () and a conductor pattern () whose surface is slidingly contacted with a slider. The insulating base () is a synthetic resin molded piece. The flexible circuit board () is insert-molded to the insulating base (). The electronic component substrate (-) is produced by preparing the flexible circuit board () and first and second mold members () having a cavity (C) with a shape that corresponds to the external shape of the electronic component substrate (-). Then, the flexible circuit board () is accommodated in the cavity (C) between the first and second mold members (), and the cavity (C) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members () are removed.

Electronic parts board and method of producing the same

A substrate ( ), a first mold ( ) and a second mold ( ) are prepared, and a plurality of switch patterns ( ), ( ) are provided by providing openings (pattern-removal portions) (A) in such a manner that a pattern ( ), which has been formed on the surface of the substrate ( ), is divided into a plurality of patterns to form A switch substrate. Next, the switch substrate ( ) is clamped between the first mold ( ) and the second mold ( ). At such time, the side of the switch substrate ( ) provided with the switch patterns ( ), ( ) is brought into surface contact with an abutting surface ( ) of the first mold ( ) and, at the same time, a cavity ( ) provided in the second mold ( ) opposes the other side of the switch substrate. Next, a molten molding resin is charged into the cavity ( ) provided in the second mold ( ) to thereby fill the cavity ( ) and the openings (A) of the substrate with the molding resin. After the molding resin hardens, the first mold ( ) and the second mold ( ) are separated and the switch substrate ( ), which will have the molding resin case attached thereto, is extracted.

Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch substrate, and a switch substrate

A rotary switch includes a contact forming member including a switch contact and a land contact and an elastic plate including a base portion mounted on the land contact and an abutment portion disposed above the switch contact. A rotor is disposed above the elastic plate for pivotal movement and includes depresser portions provided in the lower surface of the rotor for depressing the elastic plate. When the rotor is rotated, the depresser portions of the rotor cause the elastic plate to be depressed, so that the abutment portion is engaged with the switch contact. The contact forming member may be constructed by forming the switch contact and the land contact on a circuit substrate. The contact forming member may be constructed by a metal plate on which the switch contact is formed, a metal plate on which the land contact is formed, and a stationary member on which the metal plates are secured.

Rotary switch

A digital radio-relay system has a transmitting terminal station, at least one repeater station a receiving terminal station, a non-regenerative repeater station which does not regenerate a digital signal in order to simplify and reduce cost of the system, while keeping excellent signal quality in transmission. Each repeater station has a plurality of sub-units relating to respective sub-system signals each having a plurality of carriers so that the frequency spectrum of each sub-system signal is allocated on a frequency axis based upon a frequency division multiplex system. A repeater station having a first frequency converter to convert a received radio frequency to IF frequency, bandpass filters for deriving one of the carriers in each sub-system signal, amplifiers to amplify the derived carrier on IF band stage, and a second frequency converter to convert the IF frequency to radio frequency, has a common reference oscillator which generates a reference frequency which is a common divisor of all the local frequencies for all the radio frequencies of all the sub-system signals. Only one of an upper and lower heterodyne signals is taken in all the frequency conversions, so that distortion in each relay section is added in-phase. Leaked noise caused by the bandpass filters is added to original carrier in-phase. All the distortion thus added in the relay sections can be compensated by a transversal equalizer in the receiving terminal station. Therefore, excellent signal quality is obtained although a simple non-regenerative repeater station is used.

Hybrid digital radio-relay system

A mount for electronic parts includes a flexible board made of a thermoplastic resin film and having electrically conductive patterns formed thereon, and an electrically conductive bonding agent for bonding terminals of the electronic parts to the conductive patterns. Some or all of the electronic parts to be mounted are resin-molded to the flexible board so as to be integrated therewith.

Mount for electronic parts

A molded resin casing of an electronic part equipped with a flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part. A flexible board having various electric conductor patterns formed on a synthetic resin film is used as the board, the flexible board is formed integral with a flat cable including a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns, and when the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flat cable extending outwardly from a side portion of the synthetic resin casing.

Method of making molded resin casing of electronic part with flat cable

Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.

Molded resin casing of electronic part incorporating flexible board

A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.

A molded resin casing of an electronic part equipped with a flexible flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, includes a flexible board having various electric conductor patterns formed on a synthetic resin film used as the board. The flexible board is formed integrally with a flexible flat cable comprising a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns. When the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flexible flat cable extending outwardly from a side portion of the synthetic resin casing.

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Tokyo, Japan

Kozo Morita