Kyocera Corporation

Kozo Matsukawa

Tetsuo Hirakawa

A package for housing a semiconductor element is provided which allows effective prevention of adverse effects of power supply noise on the semiconductor, and normal and steady operation of the semiconductor element over a long period of time. The package for housing a semiconductor element is assembled by forming connection pads, which are connected to the power supply electrode and the grounding electrode of the semiconductor element to be housed therein, on the outer surface of a container having a space for housing the semiconductor element therein and attaching electrodes of a capacitor element to the connection pads by means of a soldering material. The soldering material is formed of an alloy consisting of from 40.0 to 45.0% by weight of silver, from 5.0 to 45.0% by weight of indium, from 15.0 to 55.0% by weight of tin, and 10.0% or less by weight of copper.

Growing community of inventors

Kokubu, Japan

Kozo Matsukawa