Nippon Kagaku Yakin Co., Ltd.

Osaka Municipal Government

Kozo Ishihara

Kiyotaka Matsukawa

Toshikazu Tanaka

Yasuyuki Agari

Masayuki Shimada

Ikuo Uemoto

Kazuo Ishikawa

Masafumi Taniguchi

Tsuneo Kamiyahata

Yoshikazu Inada

Kazuhiro Masano

Tomohiro Toyoda

An aggregate of functional particles includes a plurality of functional particles and an insulating material for covering the plurality of functional particles, and a large number of aggregates of functional particles are filled in a resin. Alternatively, insulating functional particles are added to the plurality of functional particles by an amount less than 50% of that of the functional particles in volume ratio.

Composition of a functional material, and method of and apparatus for producing same

Magnetic powder contained in a resin composition for use in injection molding is coated with an insulating material, and a soft magnetic green compact or a hard magnetic green compact is insert molded into the resin composition. Increased magnetic flux destiny, reduced size, a simplified shape, and/or increased filling density can be achieved in a core part of an electric instrument.

Method of making a magnetic core part

A soft magnetic compact which is produced by using soft magnetic composite powder in which the surface of magnetic powder is covered with an electrical insulating material containing at least an inorganic insulating material, and a resin material is fusion-bonded to the surface of the inorganic insulating material so as to partially cover the surface of the soft magnetic powder. Accordingly, it is possible to ensure an electrical insulating property between pieces of soft magnetic material powder to secure a good magnetic characteristics and to easily mold a compact.

Soft magnetic composite powder comprising an inorganic insulating coating, production method of the same, and production method of soft magnetic compact

A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500&#xb0; C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.

Resin composition with high thermal conductivity and method of producing the same

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Neyagawa, Japan

Kozo Ishihara