Seiko Epson Corporation

Kozo Gyoda

Ryoichi Nozawa

Hiroshi Kuriyama

Kazuo Oike

Youichi Kodaira

Provided is an organic EL apparatus including: an organic EL panel including organic EL devices; a heat releasing member; and a pair of film sheets of which at least one is transparent, wherein the organic EL panel and the heat releasing member overlap and are interposed and encapsulated by the pair of film sheets in a state where a portion of the heat releasing member is exposed outside the pair of film sheets.

Organic EL apparatus, method of manufacturing organic EL apparatus, electronic apparatus

An electro-optic apparatus has an electro-optic panel, driver semiconductor chips bonded onto the terminal portion of the electro-optic panel, and two protection films either or both of which are transparent, wherein the electro-optic panel is sealed by being sandwiched between the two protection films, and one protection film that covers the terminal portion has openings for exposing the driver semiconductor chips.

Electro-optic apparatus, electronic device, and method for manufacturing electro-optic apparatus

An electro-optical device includes: a supporting unit that includes a first heat release member; a second heat release member that is provided at both of two sides with respect to the supporting unit, at least a part of the second heat release member being in contact with the first heat release member; an electro-optical panel that is provided at both of the two sides with respect to the supporting unit in such a manner that at least a part of a surface of the electro-optical panel opposite to a surface thereof from which light is emitted is in contact with a surface of the second heat release member; and a transparent film sheet that covers the surface of the electro-optical panel from which light is emitted.

Electro-optical device including a heat release member

To provide a manufacturing method of an electro-optical device capable of effectively forming self-emitting elements in a large substrate on which a plurality of small substrates are arranged in a plane, without increasing the size of a manufacturing apparatus, the electro-optical device manufactured by the method, and an electronic apparatus equipped with the same. When manufacturing an organic EL display device by bonding a plurality of small substrates, processes required for a laser annealing technique and a photolithography technique, such as a process of forming TFTs and a process of forming pixel electrode, are performed before a process of bonding the small substrates to the large substrate, and organic EL elements are formed by an inkjet method after the bonding process. Further, a protective film is formed on the small substrates while the organic EL display elements are being formed.

Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus

An electro-optical device and a method for manufacturing the electro-optical device that requires no cleaning of an electro-optical material cell, and thereby results in a high production yield. The present invention includes forming an uncured sealing member having no injection port in a loop configuration in peripheral portions of respective substrate formation regions of a counter substrate base material. Further, applying a liquid crystal (an electro-optical material) in the area surrounded by the uncured sealing member in each substrate formation region to form a liquid crystal layer (an electro-optical material layer). The counter substrate base material and the substrate base material are then bonded together with the uncured sealing member interposed therebetween, thereby forming a liquid crystal cell base material (an electro-optical cell base material). The uncured sealing member is then cured, thereby forming a sealing member. The liquid crystal cell base material is diced along the outlines of the substrate formation region and the substrate formation region.

Electro-optical device including a contiguous sealing member and method for manufacturing the same

In order to provide a method for fabricating semiconductor devices and a heat treatment apparatus in which stable annealing can be performed without causing harmful effects such as thermal stresses on an insulating substrate and the surface of a semiconductor thin film formed on the insulating substrate, in a heat treatment method for a substrate provided with an amorphous silicon film in the heating step, the substrate is preheated by irradiating the substrate from the side of one surface of the substrate with intermediate infrared rays having a wavelength band of 2.5 to 5 &mgr;m, and then, in the heat-treating step, the amorphous silicon film is annealed for crystallization at temperatures between 800 to 1,000&deg; C. by irradiating the substrate from the side of the other surface of the substrate with near infrared rays having a wavelength band of 2.5 &mgr;m or less.

Method for fabricating semiconductor device and heat treatment apparatus

Liquid-crystal display unit, and process for manufacturing the same

A stamp making unit is provided having a structure such that gel photosensitive resin for forming a stamping surface can be protected appropriately and non-cured portions of the photosensitive resin can easily be removed after the stamping surface has been formed. A package capable of satisfactorily storing a stamp making unit of the foregoing type is also provided. The stamp making unit uses photosensitive resin as a base material for forming a stamping surface of a stamp which changes from a gel state to a solid state due to received light. The stamping unit comprises a stock member, photosensitive resin bonded to a surface of the stock member on which the stamping surface is formed and a cover member bonded to a surface of the photosensitive resin having light transmission properties. Adhesion between the photosensitive resin in the gel state and the stock member is weaker than adhesion between the photosensitive resin in the gel state and the cover member. Also, adhesion between the photosensitive resin in the solid state and the stock member is stronger than adhesion between the photosensitive resin in the solid state and the cover member.

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Chino, Japan

Kozo Gyoda