Tokyo Electron Limited

Koyu Hasegawa

Shingo Watanabe

Kyoko Ikeda

Kazunari Sakata

Ian Colgan

Ioan Domsa

George Eyres

Motoki Akimoto

Shinya Mochizuki

Hiroshi Motono

Moriyoshi Kinoshita

Junichi Sato

Ao Zheng

Keiichi Katabuchi

Tomoaki Abe

A transfer device of an embodiment includes a transporter including a temperature sensor disposed thereon and configured to move between a measurement position at which a temperature of a transfer target object is measured and a standby position separated from the measurement position, and a controller configured to control an operation of the transporter, and the controller moves the transporter between the measurement position and the standby position, and transfers the transfer target object by the transporter when the temperature measured by the temperature sensor at the measurement position continues to be equal to or less than a threshold for a first time.

Transfer device, substrate processing apparatus, and transfer method

Disclosed is a connection structure that connects a housing to a magnetic annealing furnace that is provided with a fixedly arranged magnet and includes a first drum flange having a cylindrical flange portion. The connection structure includes: a second drum flange that is attached and fixed to the housing and includes a flange portion configured to externally or internally fit the flange portion of the first drum flange thereto; a first sealant that is installed between facing surfaces of the housing and the second drum flange; and a second sealant that is installed between facing surfaces of the first and second drum flanges.

Connection structure, magnetic annealing device using same, and connecting method

A substrate transfer system includes a substrate transfer part capable of transferring a substrate while holding the substrate, an elevating mechanism including a support axis extending in an upper-lower direction and being capable of moving the substrate transfer part along the support axis within a predetermined range, a first exhaust port located at a position selected from at least one of on the supporting axis and near the supporting axis above an upper limit of the predetermined range, a second exhaust port located at a position selected from at least one of on the supporting axis and near the supporting axis below a lower limit of the predetermined range, and an exhaust part connected such that exhaust is available through the first exhaust port and the second exhaust port.

Substrate transfer system and heat treatment apparatus using same

A heat treatment system and method for cooling a loading chamber that includes a heat treatment furnace for heat-treating an object to be treated. The heat treatment furnace includes a throat for carrying the object in and out, and a cooling mechanism for cooling the vicinity of the throat. The cooling mechanism has a ventilating unit with a ventilating port for sending a cooling fluid toward the vicinity of the throat and a heat exchanger arranged so as to face the ventilating port in the vicinity of the throat. The cooling mechanism also has an intake fan for sucking the cooling fluid in the vicinity of the throat over the heat exchanger. When the object to be treated is carried in, the structure of various mechanisms in the vicinity of the throat is simplified, and space is saved.

Heat treatment system and a method for cooling a loading chamber

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Iwate, Japan

Koyu Hasegawa