Matsushita Electric Industrial Co., Ltd.

Kouzou Murakami

Kunihiro Fujii

Hiroki Sato

Keiji Onishi

Yoshihiro Bessho

Kentaro Setsune

Katsunori Moritoki

Michio Okajima

Akihisa Yoshida

Akihiro Nanba

Mitihiko Takase

A surface acoustic wave device includes a piezoelectric substrate, a first interdigital transducer and a second interdigital transducer formed on the substrate so that the first and second interdigital transducers are opposed to each other. The substrate includes a doping region that is doped with a substance in at least one form selected from the group consisting of atoms, molecules and clusters in a surface between the first and second interdigital transducers.

Surface acoustic wave device and method for producing the same

A surface acoustic wave device of the present invention includes a piezoelectric substrate, a plurality of comb electrodes for exciting a surface acoustic wave, disposed on a principal plane of the piezoelectric substrate, a plurality of bumps disposed on the principal plane, and an insulating sheet disposed so as to be opposed to the principal plane, wherein the bumps and the comb electrodes are connected electrically to each other, and the bumps penetrate through the insulating sheet.

Surface acoustic wave device, method for producing the same, and circuit module using the same

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Osaka, Japan

Kouzou Murakami