Tokyo Electron Limited

Koutarou Onoue

Wataru Yoshitomi

Kazuhito Miyazaki

Fumihiko Ikeda

Norihide Sagara

Fumihiro Miyazaki

Kazuki Tashima

Hikaru Kubota

Yasushi Kuranaga

Disclosed is a workpiece processing apparatus that performs a predetermined processing on a workpiece. The workpiece processing apparatus includes: a workpiece table configured to place the workpiece thereon; a processor configured to process the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the processor; a position measuring device configured to measure a position of the movement mechanism; a detector configured to detect a position of the workpiece placed on the workpiece table; and a corrector configured to calculate a positional correction amount of the workpiece table based on a measurement result of the position measuring device and a detection result of the detector.

Workpiece processing apparatus using workpiece having reference marks, workpiece processing method, and computer storage medium

A droplet ejecting apparatus includes a workpiece table configured to place a workpiece thereon, a droplet ejecting head configured to eject droplets onto the workpiece placed on the workpiece table, a Y-axis linear motor configured to move the workpiece table in a main scanning direction (Y-axis direction), a position detector configured to detect a position of a carriage mark, and a control unit configured to calculate the positional deviation amount in the main scanning direction between a detection position detected by the position detector and a reference position of the carriage mark and correct a droplet ejecting timing of the droplet ejecting head based on the positional deviation amount.

Droplet ejecting apparatus having carriage marks, droplet ejecting method, and computer storage medium

A local exposure method includes steps of: dividing a large block into a plurality of small blocks; setting irradiation illuminances different in a stepwise fashion; controlling light emission of light emitting elements based on the irradiation illuminances respectively set for the small blocks for a photosensitive film on a substrate moving with respect to light emitting elements; developing the photosensitive film having been subjected to exposure processing by irradiation by the light emitting elements; measuring a residual film thickness of the photosensitive film for each of the small blocks to obtain correlation data between the illuminance set for the small block and the residual film thickness; and obtaining a required illuminance of irradiation to each of the large blocks from a target residual film thickness of the photosensitive film set for each of the large blocks based on the correlation data.

Local exposure method and local exposure apparatus

Growing community of inventors

Kumamoto, Japan

Koutarou Onoue