Mitsubishi Materials Corporation

Koutarou Masuyama

Kazuhiko Yamasaki

Tomohiko Yamaguchi

Akihiro Higami

A metal particle aggregate includes metal particles and an organic substance. The metal particles include first particles that contain one or both of silver and copper in an amount of 70% by mass or more relative to 100% by mass of all metals and have a particle diameter of 100 nm or more and less than 500 nm at a ratio of 20 to 30% by number, and include second particles that have a particle diameter of 50 nm or more and less than 100 nm, and third particles that have a particle diameter of less than 50 nm at a ratio of 80 to 70% by number in total. Surfaces of the first to third particles are covered with the same protective film.

Metal particle aggregates, method for producing same, paste-like metal particle aggregate composition, and method for producing bonded body using said paste-like metal particle aggregate composition

Growing community of inventors

Naka, Japan

Koutarou Masuyama