Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Kousuke Yasooka

Takuya Suzuki

Minoru Hashimoto

Susumu Sato

Shigeo Udagawa

Mamoru Yoshida

Kazuyoshi Inami

Nobuyuki Shibata

Tsutomu Tamaki

Koichi Matsuo

Yoshiyuki Chatani

Takeshi Sueda

A multilayer dielectric substrate includes a first cavity-resonance suppressing circuit that suppresses cavity resonance of a first signal wave and a second cavity-resonance suppressing circuit that suppresses cavity resonance of a second signal wave, a frequency thereof being different from that of the first signal wave. These cavity-resonance suppressing circuits respectively include openings formed in a surface-layer ground conductor, an impedance transformer with a length of an odd multiple of about &#xbc; of in-substrate effective wavelength of a signal wave, a tip-short-circuited dielectric transmission line with a length of an odd multiple of about &#xbc;, of in-substrate effective wavelength of a signal wave, a coupling aperture formed in an inner-layer ground conductor, and a resistor formed in the coupling aperture. The multilayer dielectric substrate that suppresses cavity resonance of signal waves of a plurality of frequencies.

Multilayer dielectric substrate and semiconductor package

A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal conductor pad, a first signal via-hole connected to the internal conductor pad, an external conductor pad, a second signal via-hole connected to the external conductor pad, and an inner-layer signal line that connects between the first signal via-hole and the second signal via-hole. The internal conductor pad includes a leading-end open line having a length of substantially a quarter of a wavelength of a radio-frequency signal used in the radio-frequency device.

Radio-frequency package

A high-frequency module has an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.

High frequency module

A transceiver device includes a dielectric substrate, a ring member that is welded onto the dielectric substrate thereby forming a plurality of cavities, a cover that is welded onto the ring member, and at least one semiconductor device that is arranged in each of the cavities. The ring member has at least one passage that communicates between adjacent cavities. The passage is provided at a position shifted by substantially &#x3bb;g/4 or substantially n&#xd7;&#x3bb;g/2+&#x3bb;g/4 from a center axis of the cavities. If there are two or more passages, the passages are arranged at a &#x3bb;g/2 interval, and one of the passages closest to the center axis is at a position shifted by substantially &#x3bb;g/4 from the center axis.

Transceiver device

A cell group is formed from three cells, each of which has a site equipped with antennas. The antennas differ from one another in terms of horizontal orientation and cover all horizontal directions. The cell groups are arranged in a repeating pattern such that a cell having a site assigned different frequency is interposed between cell groups assigned the same frequency, thereby constituting a minimum unit area to be repeated.

Growing community of inventors

Tokyo, Japan

Kousuke Yasooka