Shoei Chemical Inc.

Kousuke Nishimura

Naoto Shindo

Hiroshi Mashima

Yuji Akimoto

Tadashi Kanasaku

Masayuki Kurahashi

Seiyu Teruya

Takamasa Imai

Nobuo Nishioka

Yoshio Miura

The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, in which a value C/Sis 2.0 to 3.4 where S(m/g) represents a specific surface area of the silver powder, and C(% by mass) represents a content percentage of the binder resin based on the silver powder, a copper content of the silver powder is 10 to 5000 ppm by mass, and the silver paste has a dry film density of 7.50 g/cmor more. The present invention can provide a silver paste containing a powder in a high concentration and excellent in printability, and accordingly provide a silver conductor film that has a high filling factor and a high film density, exhibits high electrical conductivity, and is excellent in migration resistance.

Silver paste

The present invention provides a silver paste, containing at least a silver powder, a binder resin, and an organic solvent, in which a content of the silver powder based on the silver paste is 80.00 to 97.00% by mass, D10 is 1.00 to 3.00 μm and D50 is 3.00 to 7.00 μm, where D10 and D50 respectively represent a 10% value and a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement of the silver powder, the silver powder has a specific surface area of 0.10 to 0.30 m/g, the silver powder has a copper content of 10 to 5000 ppm by mass, a content of the binder resin based on the silver powder is 0.430 to 0.750% by mass, and the silver paste has a dry film density of 7.50 g/cmor more.

The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, wherein the silver powder contains a first silver powder having a D50 of 3.50 to 7.50 &#x3bc;m and a second silver powder having a D50 of 0.80 to 2.00 &#x3bc;m, where D50 represents a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement; a copper content of the whole silver powder is 10 to 5000 ppm by mass; a copper content of the second silver powder is 80 ppm by mass or more; and the first silver powder contains substantially no copper. The present invention provides a silver paste containing a powder in a high concentration and excellent in printability, and provides a silver conductor film that has a high filling factor, a high film density, high electrical conductivity, and excellent migration resistance.

A conductive paste including a conductive powder, a glass frit, and an organic vehicle, wherein the conductive powder includes copper and/or nickel as a main component(s), and the glass frit is substantially free of Pb, Cd, and Bi, comprises 40 to 65% by mass of BaO, 15 to 23% by mass of B2O3, 2 to 12% by mass of Al2O3, 4 to 8% by mass of SiO2, 0 to 5% by mass of ZnO, 0.5 to 7% by mass of TiO2, 3 to 7.5% by mass of CaO, and comprises any one or more of MnO2, CuO, and CoO in the ranges of 0 to 7% by mass of MnO2, 0 to 16% by mass of CuO, and 0 to 5% by mass of CoO, in terms of oxide.

Conductive paste and method for forming terminal electrodes of multilayer ceramic component

A binder resin for an inorganic particle-dispersed paste that excels in both printability and adhesiveness and such an inorganic particle-dispersed paste are provided. The resin includes a mixture in which a polyvinyl acetal and a cellulose derivative are mixed so as to satisfy 0.2&#x2264;X/(X+Y)&#x2264;0.8, where X and Y stand for parts by mass of the polyvinyl acetal and the cellulose derivative, respectively. When a paste is formulated by mixing and kneading the resin with spherical nickel particles with an average particle diameter of 0.3 &#x3bc;m, barium titanate particles with an average particle diameter of 0.05 &#x3bc;m, a nonionic surfactant, dihydroterpineol, and mineral spirit at the prescribed mixing ratio, the paste has prescribed rheological characteristics.

Binder resin for inorganic particle-dispersed pastes and inorganic particle-dispersed paste

A conductive paste for forming solar cell electrodes that obtains favorable electrical characteristics and sufficient adhesion strength to a substrate. The conductive paste for forming a solar cell electrode includes the following: a tellurium-based glass frit containing 30-70 mol % of tellurium, 15-40 mol % of tungsten, 5-30 mol % of zinc, 0-20 mol % of boron, and 0-10 mol % of zirconium (where a total content of boron and zirconium is greater than 0 mol %) in terms of oxides; a conductive powder having silver as a main component and specific surface area of 0.4 m/g or more; and an organic vehicle.

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Tosu, Japan

Kousuke Nishimura