Nitto-Denko Corporation

Kousuke Murakami

Akira Arima

Shuuhei Miyazaki

Tomohiro Hattori

Yoshihiro Toyoda

A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.

Method of inspecting printed circuit board, method of manufacturing printed circuit board and inspection device of printed circuit board

An exposure system includes an exposure device and an image processing device. The exposure device includes a plurality of cameras. Each of the cameras is configured so as to be selectively set to a full scan mode and a partial scan mode. The camera transmits all of obtained image data in the full scan mode, and extracts part of the obtained image data and transmits the partial image data in the partial scan mode. The image processing device paratactically performs processing using the image data transmitted from the camera and processing using the image data transmitted from the camera.

Method of aligning photomask with base material and method of manufacturing printed circuit board

When an alignment mark does not exist within an area of an image obtained by a camera, the coordinate of the alignment mark is calculated based on an identification mark existing in the area of the image and a previously stored positional relationship between the alignment mark and the identification mark. A distance by which a long-sized base material is to be moved for causing the alignment mark to be positioned within the imaging area of the camera is calculated based on the calculated coordinate of the alignment mark, and the long-sized base material is moved by the calculated distance.

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Ibaraki, Japan

Kousuke Murakami