Sumitomo Electric Printed Circuits, Inc.

Sumitomo Electric Industries, Limited

Kousuke Miura

Hiroshi Ueda

Takashi Kasuga

Shoichiro Sakai

Yoshio Oka

Jinjoo Park

Kenji Takahashi

Koji Nitta

Maki Ikebe

Kohei Okamoto

Sumito Uehara

Junichi Motomura

Kazuhiro Miyata

Shigeaki Uemura

Yoshihito Yamaguchi

Yasuhiro Okuda

Hirohisa Saito

Issei Okada

Eiko Imazaki

Satoshi Kiya

Shigeyoshi Nakayama

Masahiro Matsumoto

Masahiro Itoh

Yuka Urabe

Makoto Nakabayashi

Atsushi Kimura

Kou Noguchi

Motohiko Sugiura

Kayo Hashizume

Kouji Nitta

Masahiro Itou

A wet treatment apparatus is configured to treat a continuously moving sheet-shaped workpiece and includes a wet treatment tank including a side surface portion having a first slit, a pair of rolls located outside the wet treatment tank, the pair of rolls being spaced apart from the first slit and being arranged in such a manner as to nip the workpiece in a transverse direction, and a pair of treatment-liquid shield members disposed on a side opposite to a side on which the wet treatment tank is disposed with the pair of rolls interposed between the pair of treatment-liquid shield members and the wet treatment tank in a movement direction of the workpiece. In a direction parallel to a width of the first slit, a width of the shield member is larger than a width of the roll.

Wet treatment apparatus and method of manufacturing flexible printed circuit board

A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.

Planar coil element and method for producing planar coil element

A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Printed wiring board production method and printed wiring board production apparatus

A printed wiring board according to an aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 &#x3bc;m or greater to 50 &#x3bc;m or smaller, and an average thickness of the second conductive portion is 1 &#x3bc;n or greater to smaller than 8.5 &#x3bc;m.

Printed wiring board and manufacturing method thereof

A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90&#xb0; or less with pure water.

Fluororesin base material, printed wiring board, and circuit module

A printed wiring board includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated so as to run on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 &#x3bc;m or greater to 50 &#x3bc;m or smaller, and an average thickness of the second conductive portion is 1 &#x3bc;m or greater to smaller than 8.5 &#x3bc;m. A method for manufacturing a printed wiring board includes a first conductive portion forming step of forming a first conductive portion forming each wiring portion by plating an opening of the resist pattern on the conductive foundation layer, a conductive foundation layer removing step, and a second conductive portion coating step.

A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is &#xbd; or more and 5 or less.

A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.

Printed circuit board and method of manufacturing a printed circuit board

A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first and second surfaces of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator. An average diameter of the through-hole is 20 &#x3bc;m or greater and 35 &#x3bc;m or less at the first surface, and is 3 &#x3bc;m or greater and 15 &#x3bc;m or less at the second surface, and an average thickness of the metal plated layer formed on the first and second surfaces is 8 &#x3bc;m or greater and 12 &#x3bc;m or less.

Printed wiring board and method for manufacturing printed wiring board

A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, a conductive pattern that is stacked on at least one surface side of the base film and that includes a plurality of wiring portions arranged adjacent to one another, and an insulating layer that covers outer surfaces of the base film and the conductive pattern. The plurality of wiring portions have an average spacing of 1 &#x3bc;m or more and 20 &#x3bc;m or less and an average height of 30 &#x3bc;m or more and 120 &#x3bc;m or less. A filling area ratio of the insulating layer between the plurality of wiring portions adjacent to one another in sectional view is 95% or more.

Printed circuit board and method for producing the same

A flexible printed circuit board according to an embodiment of the present invention includes an insulative base film; and a conductive pattern provided on at least one surface of the base film and including a wiring line including a bent portion having an angle of greater than or equal to 60&#xb0; or a branched portion having an angle of greater than or equal to 60&#xb0; in plan view. The wiring line is provided with a relaxation structure that relaxes stress concentration at the bent portion or the branched portion. The relaxation structure is structured such that the wiring line constitutes a wide wiring line or a dense wiring line group in a region in which a distance from the bent portion or the branched portion is less than or equal to 5 times a minimum width of the wiring line. The wide wiring line has a wiring line width that is greater than or equal to twice the minimum width of the wiring line. A ratio of a wiring line width to a wiring line interval of the dense wiring line group is greater than or equal to 1.5, and a total width of the dense wiring line group is greater than or equal to twice the minimum width of the wiring line.

Flexible printed circuit board

A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.

Base material for printed interconnect boards and manufacturing method of printed interconnect boards

A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.

Printed circuit board and electronic component

A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.

Growing community of inventors

Koka, Japan

Kousuke Miura