Fuji Electric Co., Ltd.

Kousuke Komatsu

Masaki Takahashi

Rikihiro Maruyama

A circuit pattern, which is a second negative electrode wiring, and a horizontally extending area of a circuit pattern, which is a first negative electrode wiring, are connected electrically and mechanically by a vertically extending area of the circuit pattern and wires, which are an inter-negative-electrode wiring. As a result, N terminals and N1 terminals are equal in potential in a semiconductor device. The N terminals of a converter circuit section and the N1 terminals of an inverter circuit section are electrically connected to make the N terminals and the N1 terminals equal in potential.

Semiconductor device

A semiconductor device includes a laminated substrate having a circuit board; a semiconductor chip fixed to the circuit board; a terminal having a leading end portion with a cylindrical shape and a wiring portion with a shape other than the cylinder, the leading end portion and the wiring portion being formed of one conductive member; and a joining material which electrically and mechanically connects the circuit board and the leading end portion.

There is provided a semiconductor device provided with a metal base, a frame-shaped resin case adhered to the metal base, a semiconductor chip having a main electrode and being disposed inside the resin case, a main terminal having an internal end which is electrically connected to the main electrode of the semiconductor chip, integrally fixed to the resin case, and exposed inside the resin case and an external end exposed outside the resin case, a heat dissipation member which is placed, in contact with the metal base, between the metal base and the internal end of the main terminal, and has higher thermal conductivity than that of the resin case.

A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled in the casing, a first conductive block disposed in the casing, and a first connection terminal being bent so as to implement an elongated U-shape. The semiconductor device is adapted for electrical connection to a circuit board having a first land. The circuit board is placed on the ceiling wall. The first window is at a position corresponding to the first land. A lower end of the first conductive block is connected to a surface of the output electrode and the first connection terminal contacts to the first conductive block.

Semiconductor device and casing of the semiconductor device

A semiconductor device includes a terminal case, a beam portion which has elasticity and is connected to the terminal case, divided insulating substrates with a conductive pattern, a fastener which is disposed at the center of the terminal case, and an elastic sealing resin which fills the terminal case.

Semiconductor device and semiconductor device fabrication method

A semiconductor device of a three-level inverter circuit with a reduced number of power supplies for driving IGBTs. The semiconductor device includes a series-connected circuit of IGBTs between P and N of a DC power supply and an AC switch element that is connected between a series connection point of the series-connected circuit and a neutral point of the DC power supply. The series-connected circuit and the AC switch element are integrated into one module. The AC switch element is formed by connecting a collector of a first IGBT to which a diode is connected in reverse parallel and a collector of a second IGBT to which a diode is connected in reverse parallel, and an intermediate terminal is provided at a connection point between the collectors.

Growing community of inventors

Matsumoto, Japan

Kousuke Komatsu