Kabushiki Kaisha Toshiba

Kouki Okazaki

Naruhiko Mukai

Yuji Sano

Chikara Konagai

Nobutada Aoki

Arata Ito

Muneyoshi Kikunaga

An underwater laser processing method is carried out by irradiating, through a laser beam irradiation apparatus, a laser beam having a high output, a short pulse and a visible wavelength to a surface of a structure immersed in a water to improve residual stress of a material of the surface of the structure and remove a crack or a CRUD thereof. The laser beam irradiation apparatus comprises a pulse laser device suspended into a water in which a metal material is accommodated from an upper side thereof for irradiating a laser beam having a visible wavelength to a processing position, a beam strength adjusting device for adjusting an output per 1 pulse of a laser beam generated by the pulse laser device and a mechanism for adjusting a spot diameter and a multiplexing ratio of an irradiated beam.

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Higashimurayama, Japan

Kouki Okazaki