Panasonic Corporation

Koujiro Nakamura

Yoshihiro Tomura

Kentaro Kumazawa

Kazuhiro Nobori

Teppei Iwase

Takayuki Higuchi

A flip-chip mounting apparatus has a shield film () on the side of a pressurizing film () of a tool protection sheet (). When a semiconductor chip () is heated and pressurized via the tool protection sheet (), the pressurizing film () is released from a mold by a sheet fixing jig (), and is expanded by a pressurizing/heating tool () to abut against an insulating resin film () protruding from the periphery of the semiconductor chip () and cure the insulating resin film () with an external pressure being applied.

Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus

The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chipmounted on the top surface of the circuit boardoverlaps with the semiconductor chipmounted on the bottom surface of the circuit board, a recess portion(or a protruding portion) is formed in the surfaces of the circuit board

Growing community of inventors

Osaka, Japan

Koujiro Nakamura