Matsushita Electric Industrial Co., Ltd.

Kouji Tanabe

Naohiro Nishioka

Futoshi Matsui

Toshiharu Fukui

Kouichi Santo

Naoki Sera

Kenji Otomo

Yoshihito Okazaki

Noahiro Nishioka

Kenji Ootomo

EL sheet diaphragm and a switch using the same

A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.

Flexible wiring board and its fabrication method

A flexible printed circuit board is constituted with a first insulation film covering a first insulating resist layer, a second insulation film covering a second insulating resist layer and a printed circuit formed between the first insulating resist layer and the second insulating resist layer, and a terminal of an electronic component is disposed on the printed circuit, and the second insulation film is pressed and heated.

Flexible printed circuit board

Method for mounting electronic component on a flexible printed circuit

A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on thed printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.

A method for electrically connecting an upper wiring with a lower wiring consists of the steps of arranging the upper wiring mixed with thermo-softening material on an upper insulating sheet, arranging the lower wiring mixed with thermo-softening material on a lower insulating sheet, putting the upper insulating sheet on the lower insulating sheet to bring the upper wiring into contact with the lower wiring, and providing ultrasonic vibration to the upper and lower wirings and the upper insulating sheet while pushing the upper insulating sheet toward the lower insulating sheet. In these steps, the upper and lower wirings and the upper insulating sheet are heated and melted because friction heat is generated by the ultrasonic vibration. Thereafter, the upper insulating sheet is pushed into the upper and lower wirings while pushing these wirings aside and is boded with the lower insulating sheet. Also, the upper wiring is bonded with the lower wiring so that these wirings are electrically connected.

Method for connecting a wiring arranged on a sheet with another wiring

Anisotropic conductive material is employed instead of solder for connecting between the terminal of a component and a printed circuit board. In addition to the printed circuit board, a printed circuit sheet is provided and the terminal of the component is sandwiched between both anisotropic materials on the printed circuit board and beneath the printed circuit sheet. From both outside surfaces of the printed circuit board and the sheet, heat and pressure are simultaneously applied to the terminal part (i.e. thermocompression bonding).

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Katano, Japan

Kouji Tanabe