Hoya Corporation

Nabtesco Automotive Corporation

Mitsubishi Denki Kabushiki Kaisha

Tdk Corporation

Subaru Corporation

Takahashi Seimitsu Kogyo Kabushiki Kaisha

Kouji Takahashi

Katsunori Tanaka

Ichiro Minato

Hiroshi Tomiyasu

Hiroyuki Murakami

Takemi Miyamoto

Tomotaka Yokoyama

Yoshihiro Mitsuhashi

Taku Kawakami

Genshichi Hata

Satoshi Ueda

Yoshiji Inoue

Norio Sasaki

Yoshiharu Watanabe

Rikio Takahashi

Tsuguo Nakazawa

In a fastener structure for a vehicle, a height adjustment spacer is interposed between first and second vehicle body frames fixed with a bolt and a nut. The nut has a first insertion hole through which a bolt is screwed, and is fixed to a surface of the first vehicle body frame. The height adjustment spacer has a second insertion hole through which the bolt is inserted, and is disposed in contact with another surface of the first vehicle body frame. The bolt is inserted through an attachment hole of the second vehicle body frame, the second insertion hole, an attachment hole of the first vehicle body frame, and the first insertion hole. On a contact surface between the height adjustment spacer and the first vehicle body frame, a protrusion and a recess are provided to surround an entirety of the second insertion hole, the second insertion hole respectively.

Fastener structure for vehicle

It is intended to provide a vacuum pump so that without upsizing the vacuum pump, noise and vibration are reduced, heat dissipation property is secured, and the casing is downsized. Therefore, at least one turning part is provided in an exhausting path formed in a casing body. The casing body is formed of a material whose thermal conductivity is higher than that of a rotor and vanes, and a cylinder part where the vanes slide is press fitted in the casing body.

Rotary pump having a casing being formed with a communicating hole communicating a space that is between the side plate and the wall surface of the driving machine

Vacuum pump having rotary compressing elements

A substrate for an information recording medium has a microwaviness average height Ra' not greater than 0.05 microinch as measured by a contactless laser interference technique for measurement points within a measurement region of 50 &#x3bc;m&#x25a1;-4 mm&#x25a1; on a surface of the substrate. The microwaviness average height Ra&#x2032; is given by:where xi represents a measurement point value of each measurement point, {overscore (x)} representing an average value of the measurement point values, n representing the number of said measurement points. Alternatively, the substrate has a waviness period between 300 &#x3bc;m and 5 mm and a waviness average height Wa of 1.0 nm or less as measured by the contactless laser interference technique for measurement points in a measurement region surrounded by two concentric circles which is spaced from a center of a surface of the substrate by a predetermined distance. The waviness average height Wa is given by:where Xi represents a measurement point value of each measurement point, {overscore (X)} representing an average value of the measurement point values, n representing the number of said measurement points.

Substrate for an information recording medium, information recording medium using the substrate, and method of producing the substrate

A substrate for an information recording medium, wherein the period of microwaviness is 2 &mgr;m to 4 mm, and if we let wa be the maximum height of this microwaviness and Rmax be the maximum height measured by atomic force microscope, the main surface of the substrate has a wa of no more than 5 nm and an Rmax of no more than 12 nm, provided that wa is the difference between the highest and lowest points on a measurement curve of all measured points in a measurement area.

Substrate for information recording medium, information recording medium, and method for controlling surface of substrate for information recording medium

Substrate for an information recording medium, information recording medium using the substrate and method of producing the substrate

A master-slave flip-flop circuiting having transistors connected in cascade in two stages between a power supply and ground. A clock differential amplifier, a master flip-flop, a slave flip-flop, and a waveform-shaping amplifier are all connected mutually in parallel to a power supply. High-speed operation at a minimum operation power supply voltage is achieved.

Master-slave flip-flop circuit

A dielectric ceramic composition having the composition represented by formula (1):

Dielectric ceramic composition

A yarn cutting scissors device suitable for use for cutting a weft is disclosed which is capable of decreasing the frictional force occurring between a stationary blade and a movable blade when both blades are successively engaged in the cutting operation and effectively accomplishing the accessible engagement between both blades. The yarn cutting scissors device includes a leaf spring which has one end fixedly mounted on a support block and the other end on which a stationary blade is mounted, a shim washer arranged between the support block and the leaf spring, and a compression coil spring mounted on the support block to constantly urge a movable blade against the stationary blade, so that the stationary blade may be oscillated in the direction perpendicular to that of oscillation of the movable blade.

Yarn cutting scissors device

Growing community of inventors

Tokyo, Japan

Kouji Takahashi