Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Kouji Nitta

Kenji Takahashi

Akihisa Hosoe

Shinji Inazawa

Shoichiro Sakai

Kousuke Miura

Maki Ikebe

Junichi Motomura

Hiroshi Takada

Masahiro Itou

A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.

Base material for printed interconnect boards and manufacturing method of printed interconnect boards

A board for printed wiring comprises an electromagnetic wave absorbing laminate (EM) provided on a surface of a substrate () with the intervention of an adhesive layer () of a metal oxide, the electromagnetic wave absorbing laminate (EM) comprising: (a) a magnetic layer () comprising a plurality of magnetic particles () having an average particle diameter of 1 to 150 nm and isolated from each other by an electrically insulative material (); and (b) an electrically insulative layer (), being alternately stacked in a multi-layer structure, the board for printed wiring has a reduced thickness and an improved electromagnetic wave absorbing characteristic in a high frequency band of not lower than gigahertz, as compared with a conventional one which has an electromagnetic wave absorbing layer of a composite material including fine magnetic particles simply dispersed in a resin binder.

Board for printed wiring

Growing community of inventors

Osaka, Japan

Kouji Nitta