Denka Company Limited

Kouji Nishimura

Akimasa Yuasa

Yusaku Harada

Takahiro Nakamura

Shuhei Morita

Ryota Aono

Yuta Tsugawa

Fumihiro Nakahara

Shoji Iwakiri

A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, wherein a ceramic substrate and a copper plate are bonded by a braze material containing Ag and Cu, at least one active metal component selected from Ti and Zr, and at least one element selected from among In, Zn, Cd, and Sn, wherein a braze material layer, after bonding, has a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv.

Ceramic circuit board and module using same

A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 &#x3bc;m or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

Ceramic circuit board and production method therefor

A ceramic circuit substrate and power module with excellent heat cycle resistance characteristics, which is formed by bonding a ceramic substrate and a copper plate via a brazing material including Ag, Cu, and an active metal, wherein the bond void fraction is no greater than 1.0% and the diffusion distance of the Ag, which is a brazing material component, is 5-20 &#x3bc;m. Also, a method for manufacturing a ceramic circuit substrate characterized in that the heating time in a temperature range 400-700&#xb0; C. in a process for raising the temperature to a bonding temperature is 5-30 minutes and bonding is performed by maintaining the bonding temperature at 720-800&#xb0; C. for 5-30 minutes.

Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board

A ceramic circuit substrate is suitable for silver nanoparticle bonding of semiconductor elements and has excellent close adhesiveness with a power module sealing resin. A ceramic circuit substrate has a copper plate bonded, by a braze material, to both main surfaces of a ceramic substrate including aluminum nitride or silicon nitride, the copper plate of at least one of the main surfaces being subjected to silver plating, wherein: the copper plate side surfaces are not subjected to silver plating; the thickness of the silver plating is 0.1 &#x3bc;m to 1.5 &#x3bc;m; and the arithmetic mean roughness Ra of the surface roughness of the circuit substrate after silver plating is 0.1 &#x3bc;m to 1.5 &#x3bc;m.

Ceramic circuit substrate

A ceramic circuit substrate having a metal plate bonded, by a bonding braze material, to at least one main surface of a ceramic substrate, wherein the bonding braze material contains, as metal components, 0.5 to 4.0 parts by mass of at least one active metal selected from among titanium, zirconium, hafnium, and niobium, with respect to 100 parts by mass, in total, of 93.0 to 99.4 parts by mass of Ag, 0.1 to 5.0 parts by mass of Cu, and 0.5 to 2.0 parts by mass of Sn; and Cu-rich phases in a bonding braze material layer structure between the ceramic substrate and the metal plate have an average size of 3.5 &#x3bc;m or less and a number density of 0.015/&#x3bc;m2 or higher. A method for producing a ceramic circuit substrate includes bonding at a temperature of 855 to 900&#xb0; C. for a retention time of 10 to 60 minutes.

Ceramic circuit board and method for producing same

Disclosed herein is a ceramic circuit substrate for a power module obtained by applying an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and the lowering of insulation to a main surface of a metal circuit and to the outer periphery of the metal circuit or between metal circuits, respectively. Also disclosed herein are methods for manufacturing a ceramic circuit substrate for a power module.

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Omuta, Japan

Kouji Nishimura