Jsr Corporation

Samsung Electronics Co., Ltd.

Canon Kabushiki Kaisha

Kouji Nishikawa

Yoshihiro Ogawa

Takashige Kasuya

Yusuke Hasegawa

Katsuhisa Yamazaki

Masami Fujimoto

Daisuke Yoshiba

Yoshitaka Suzumura

Shotaro Nomura

Shin-ichiro Iwanaga

Hiroki Akiyama

Tooru Kimura

Soo-Kyung Kim

Myung-sun Kim

Hyojin Yun

Hirofumi Goto

Miho Okazaki

Hidetoshi Miyamoto

Akari Sako

Kentarou Kamae

Changeun Yoo

Shin-Ichiro Iwanaga

A compound synthesis method includes bonding a first compound to a substrate to form a first film. A second film is formed on the first film using an acid-transfer composition including (A) a polymer that includes a structural unit shown by a following formula (1) and a structural unit shown by a following formula (2), (B) a photoacid generator shown by a following formula (3), and (C) a sensitizer shown by a following formula (4). The second film is exposed to remove the protecting group from the first compound under an exposed area of the second film. An acid generated in the exposed area of the second film is transferred to the first film. The second film after being exposed is removed. A second compound is bonded to the first compound from which the protecting group has been removed. 

Compound synthesis method, microarray, acid-transfer composition, and biochip composition

A first film-modifying method includes forming a second film on a first film that includes an acid-dissociable group. The second film is an acid transfer resin film that includes a photoacid generator. The second film is exposed via a mask so that the second film generates an acid. The acid generated by the second film is transferred to the first film. The second film is removed.

Method for modifying first film and composition for forming acid transfer resin film used therefor

A negative-tone radiation-sensitive resin composition includes an alkali-soluble resin, a radically polymerizable compound, a radiation-sensitive radical initiator, and an organic solvent. The alkali-soluble resin includes a phenolic hydroxyl group. The radically polymerizable compound includes an ethylenically unsaturated double bond. The organic solvent includes an ethylene glycol organic solvent having a saturation vapor pressure of 3 mmHg or less at 20&#xb0; C. and 1 atmosphere.

Negative radiation-sensitive resin composition

It is an object of the present invention to provide a process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a negative radiation-sensitive resin composition which is preferably used for the process and has excellent sensitivity and resolution, and a transfer film using the composition. The above object is achieved by a negative radiation-sensitive resin composition comprising (A) a polymer containing structural units represented by the following formula (1) and/or the following formula (2), (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator, and by forming a negative radiation-sensitive resin film using the composition. 

The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 &#x3bc;m in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 &#x3bc;m. According to the photosensitive resin film, a high bump having a height of not less than 50 &#x3bc;m can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.

Photosensitive resin film and cured film made therefrom

Growing community of inventors

Tokyo, Japan

Kouji Nishikawa