Toyo Kohan Co., Ltd.

Toyo Seikan Group Holdings, Ltd.

Sumitomo Electric Industries, Limited

Toyota Jidosha Kabushiki Kaisha

Kouji Nanbu

Hironao Okayama

Hiroshi Shimomura

Teppei Kurokawa

Takashi Koshiro

Hirohisa Masuda

Toshihiko Miyazaki

Hajime Ota

Takashi Yamaguchi

Kotaro Ohki

Akira Kaneko

Kenji Kimura

Satoshi Aoyama

Kazuhiko Hayashi

Kazuo Yoshida

Kazuya Ohmatsu

Shinji Ohsawa

Yoshihiko Isobe

Yasuhiro Izawa

Kazuya Ohmastu

A substrate for flexible device, including a stainless steel sheet, an oxide layer formed on a surface of the stainless steel sheet, and a glass layer of electrically-insulating bismuth-based glass formed in a form of layer on the surface of the oxide layer. Also disclosed is a sheet for flexible device, including a stainless steel sheet, and an oxide layer on a surface of the stainless steel sheet, the oxide layer having a thickness of not less than 30 nm.

Substrate for flexible device

A substrate for flexible device. The substrate has a nickel-plated metal sheet having a nickel-plating layer formed on at least one surface of a metal sheet or a nickel-based sheet, and a glass layer of an electrically-insulating layered bismuth-based glass on a surface of the nickel-plating layer or the nickel-based sheet. An oxide layer having a roughened surface is formed on the surface of the nickel-plating layer or the surface of the nickel-based sheet, and the bismuth-based glass contains 70 to 84% by weight of BiO, 10 to 12% by weight of ZnO, and 6 to 12% by weight of BO. Also disclosed is a method for producing the substrate for flexible device, a substrate for an organic EL device, a sheet used as a substrate for flexible device, a method for producing the sheet and a bismuth-based lead-free glass composition.

Substrate for flexible device and method for producing the same

A substrate for a flexible device which includes a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, and a glass layer of electrical insulating bismuth-based glass formed in the form of layer on a surface of the nickel plating layer.

It is an objective of the present invention to provide a metal laminate material, which has sufficient strength as well as molding processability, lightweight properties, and radiation performance, which is a metal laminate material that has a two-layer structure of a stainless steel layer and an aluminum layer or a three-layer structure of a 1st stainless steel layer, an aluminum layer, and a 2nd stainless steel layer, wherein tensile strength TS is 200&#x2264;TS&#x2264;550 (MPa), elongation EL is not less than 15%, and a surface hardness Hv of the stainless steel layer is not more than 300 for the metal laminate material.

Metal laminate material and production method therefor

An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.

Method for producing metal laminate material

An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum &#x394;&#x3d5; of a peak based on the pole figure of the copper layer is within 5&#xb0; and the tail width &#x394;&#x3b2; of the peak based on the pole figure is within 15&#xb0; Such a substrate for epitaxial growth is manufactured by a 1step of performing heat treatment of a copper layer so that &#x394;&#x3d5; is within 6&#xb0; and the tail width &#x394;&#x3b2; is within 25&#xb0;, and after the 1step, a 2step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1step, so that &#x394;&#x3d5; is within 5&#xb0; and the tail width &#x394;&#x3b2; is within 15&#xb0;.

Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wire

A method of manufacturing a hydrogen separation membrane with a carrier is characterized by including a first step of providing, between the hydrogen separation membrane and the carrier that supports the hydrogen separation membrane, a low-hardness metal membrane having a hardness that is lower than the hardness of the hydrogen separation membrane, and a second step of joining the hydrogen separation membrane, the low-hardness metal membrane, and the carrier by a cold joining method. In this case, it is possible to suppress the deformation of the hydrogen separation membrane, the low-hardness metal membrane, and the carrier and, as a result, it is possible to prevent damaging of the hydrogen separation membrane. The adhesion of the contact between the hydrogen separation membrane and the carrier is also improved. The result is that it is not necessary to increase the severity of the cold joining conditions.

Hydrogen separation membrane with a carrier, fuel cell and hydrogen separation apparatus having same, and method of manufacturing same

Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.

Substrate for superconducting compound and method for manufacturing the substrate

A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.

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Kudamatsu, Japan

Kouji Nanbu