Daicel Corporation

Kouji Nakatani

Fei Yang

Feng Liu

Takayuki Yaegashi

Yoshimichi Okano

Michiyo Nakai

Tsukasa Yoshida

Yusuke Okamoto

There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), Rand Reach represent a curable functional group; Dand Deach represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Arto Areach represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents &#x2014;CO&#x2014;, &#x2014;S&#x2014; or &#x2014;SO&#x2014;; each Y represents &#x2014;S&#x2014;, &#x2014;SO&#x2014;, &#x2014;O&#x2014;, &#x2014;CO&#x2014;, &#x2014;COO&#x2014; or &#x2014;CONH&#x2014;; and n represents an integer of 0 or more): 

Curable compound

Growing community of inventors

Himeji, Japan

Kouji Nakatani