Nec Corporation

Renesas Electronics Corporation

Nec Electronics Corporation

Kouji Matsui

Takuo Funaya

Katsumi Kikuchi

Shinichi Miyazaki

Shintaro Yamamichi

Hideya Murai

Hirokazu Honda

Tadanori Shimoto

Keiichiro Kata

Kazuhiro Baba

Naoji Senba

Akinobu Shibuya

Hidehito Matsuyama

A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

A user uses part data forming means and module data forming means to input the actual dimension, physical constants and mesh dividing number for fundamental shapes which are registered in advance, thereby forming parts, and then indicates the relative position between the parts to form the entire shape of an assembly of plural parts without paying attention to coincidence or non-coincidence of nodal points. Data converting means divides the shape of each part thus assembled according to the indicated mesh divisional number to generate element data and nodal point data. Further, it generates a constraint equation for connecting nodal points which are non-connected between neighboring parts, and forms an analysis model . A finite element method analyzer uses approximate calculation means to approximate a non-connected nodal point displacement from a nodal point displacement of neighboring structural elements on the basis of the constraint equation.

Method, apparatus and computer program product for forming data to be analyzed by finite element method and calculation method based on finite element method

There is provided a function element including a resin layer formed on a surface thereof, the resin layer having adhesive property and sealing property, the resin layer having such a pattern that a resin layer does not exist in at least one of following areas: (a) a first area around an area where device performances are influenced by resin of which the resin layer was composed, (b) a second area around pads or bumps, (c) a third area around an area on which a wiring of a substrate will exist when the function element is coupled to the substrate, and (d) a fourth area around an area on which a passive element mounted on a substrate will exist when the function element is coupled to the substrate. The function element prevents extra resin from adhering to an area of the function element where device performances will be influenced by the resin, when the function element is coupled to a substrate with a resin layer being sandwiched therebetween.

Function element, substrate for mounting function element thereon, and method of connecting them to each other

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Tokyo, Japan

Kouji Matsui