Denso Corporation

Ube Exsymo Co., Ltd.

Kouji Kondoh

Yasuhiro Sagou

Gentaro Masuda

Hidetada Kajino

Tetsuo Fujii

Yoshihiko Shiraishi

Hideki Seki

Kimitake Ishikawa

Taro Suzuki

Tomohiro Yokochi

Hideaki Kako

Manabu Maeda

Hiroyasu Oide

Norihisa Imaizumi

Makoto Totani

Koji Ota

Yukihiro Maeda

Naoto Sakai

Takeshi Yamauchi

Eijirou Miyagawa

Kazuo Tada

Akihiro Yamaguchi

Hirotaka Miyano

Yoshiharu Harada

Masaaki Inoguchi

Kenji Kondoh

Eisuke Tachibana

Junya Kasahara

Takao Arima

Ryuma Kamikomaki

Gentarou Masuda

A semiconductor package includes a semiconductor chip, a heat radiating member on which the semiconductor chip is mounted, and a sealing member sealing the semiconductor chip. The sealing member is made of a liquid crystal polymer.

Semiconductor package, electronic device, and method for manufacturing semiconductor package

A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.

Flexible laminated board and multilayer circuit board

A heating part of this radiant heater has a plurality of heating wires. The plurality of heating wires are connected in parallel such that a plurality of parallel groups may be formed by electrodes. Further, the plurality of parallel groups are connected in series by the electrodes. The heating parts are set to reach a radiation temperature for emitting the heat radiation which makes a human to feel warmth. The heating parts have a thermal resistance in a longitudinal direction which is set, when an object contacts on the surface, a temperature of the part where the object touches falls to a suppressed temperature lower than the radiation temperature. The temperature of the heating part increases rapidly in response to electric supply. When there is a contact with an object, the temperature of the heating part decreases rapidly.

Radiant heater

A radiation heater apparatus has a plurality of heat radiation parts and a plurality of heating parts. A low thermal conductive part is formed between adjacent two of the heat radiation parts. The low thermal conductive part is provided with resin material which mainly forms a substrate part. The low thermal conductive part thermally isolates the heat radiation part by surrounding a periphery of the heat radiation part. As a body contacts with the surface of the apparatus, the thermal energy of specific heat radiation part directly under the body dissipates heat to the body. Furthermore, heat transfer from the periphery of the specific heat radiation part to the specific heat radiation part is reduced by the low thermal conductive part.

Radiation heater apparatus

In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base film are integrated by hot pressing. The base film has a terminal-connecting through hole for receiving an electrode terminal of an electronic component to be connected to a conductive pattern of the low-fluidity resin film disposed at an end of the stacked body. An electronic component mounting section of the stacked body, which is an area corresponding to the electronic component mounted on the base film in a stacking direction, is configured such that a number of the conductive patterns located in a corresponding section that corresponds to the through hole in the stacking direction is greater than a number of the conductive patterns located in a non-corresponding section without corresponding to the through hole in the stacking direction.

Multilayer board

A circuit board includes an insulating member and a semiconductor chip encapsulated with the thermoplastic resin portion of the insulating member. A wiring member is located in the insulating member and electrically connected to first and second electrodes on respective sides of the semiconductor chip. The wiring member includes a pad, an interlayer connection member, and a connection portion. A diffusion layer is located between the first electrode and the connection portion, between the pad and the connection portion, and between the second electrode and the interlayer connection member. At least one element of the interlayer connection member has a melting point lower than a glass-transition point of the thermoplastic resin portion. The connection portion is made of material having a melting point higher than a melting point of the thermoplastic resin portion.

Circuit board with built-in semiconductor chip and method of manufacturing the same

The termination circuit for use in a transmission line to transmit a differential signal includes a first series circuit of a resistive element and an inductive element connected between one of two signal wires of the transmission line and a reference potential, and a second series circuit of a resistive element and an inductive element connected between the other of the signal wires and the reference potential. The inductive elements of the first and second series circuits are magnetically coupled such that they generate magnetic fields having such directions as to reinforce each other when a common-mode signal flows along the transmission line, and generate magnetic fields having such directions as to weaken each other when a differential-mode signal flows along the transmission line.

Termination circuit, vehicle-mounted control apparatus, and vehicle-mounted communication system

Growing community of inventors

Toyohashi, Japan

Kouji Kondoh