Hitachi Chemical Company, Ltd.

Kouji Kobayashi

Motohiro Arifuku

Itsuo Watanabe

Tohru Fujinawa

Isao Tsukagoshi

Kazuyoshi Kojima

Yasushi Gotoh

Kouji Motomura

Naoki Fukushima

Yasushi Gotou

Takashi Tatsuzawa

Takashi Nakazawa

Nichiomi Mochizuki

Kazuya Matsuda

Jyunichi Koide

Tomohisa Ohta

Osamu Watanabe

Kenzo Takemura

Naoyuki Shiozawa

Yukihisa Hirosawa

Hiroshi Matsuoka

Hiroshi Yasuda

The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.

Circuit connection material, circuit member connecting structure and method of connecting circuit member

The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 &#x3bc;m or greater but less than 10 &#x3bc;m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40&#xb0; C. and a mean coefficient of thermal expansion of 30 to 200 ppm/&#xb0; C. at from 25&#xb0; C. to 100&#xb0; C. when subjected to the curing treatment.

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection. The circuit connecting method comprises a step of preparing a circuit memberhaving circuit electrodesformed on a glass substrate, a step of preparing a flexible wiring boardhaving circuit electrodesformed on a baseand provided with a solder resistat the sections of the circuit electrodesother than the sections that are connected to the circuit electrodes, and a step of bonding the circuit memberto the flexible wiring boardvia an anisotropic conductive film for circuit connectionso that part of the anisotropic conductive film for circuit connectionoverlaps with part of the solder resist. The thickness hof the anisotropic conductive film for circuit connectionis no greater than the total of the height hof the circuit electrodesand the height hof the circuit electrodes

Circuit connecting method

A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

Wiring terminal-connecting adhesive

This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Adhesive, method of connecting wiring terminals and wiring structure

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles

Adhesive agent, method of connecting wiring terminals and wiring structure

An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode.

Adhesive-coated electronic parts on a connection sheet

The present invention is to provide a method for removing adhesive in a short time without requiring any solvent, a repair of which has conventionally been required for a long time, and there is provided a method for repairing a circuit connection part where circuit members having a large number of opposed circuits are connected electrically through an adhesive, wherein mutual joints at a circuit connection part requiring repair are separated, a basic material for transfer is bonded through a transfer adhesive for transfer to at least one circuit member where the adhesive remains and then the adhesive remaining on the circuit member and the transfer adhesive are removed from the circuit member along with the basic material for transfer.

Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method

An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode

Method of mounting a plurality of electronic parts on a circuit board

Growing community of inventors

Ibaraki, Japan

Kouji Kobayashi