Du Pont-mitsui Polychemicals Co., Ltd.

Mitsui Chemicals, Inc.

Mitsui Petrochemical Industries, Ltd.

Kouji Kitahara

Toshiyuki Ishii

Yoshikazu Kutsuwa

Yuji Sawada

Toshihiro Nishimura

Akihiko Yamamoto

Naoshi Hamada

The adhesive resin composition of this invention comprises (A) 30 to 70 parts by weight of an ethylene/vinyl acetate copolymer, (B) 0 to 50 parts by weight of an ethylene/&agr;-olefin copolymer having an ethylene content of 30 to 95 mole % and a degree of crystallinity by X-ray of not higher than 40%, (C) 0 to 50 parts by weight of a modified ethylene/&agr;-olefin copolymer having an ethylene content of 30 to 95 mole % and a degree of crystallinity by X-ray of not higher than 40%, (D) 0 to 30 parts by weight of modified polyethylene, (E) 1 to 20 parts by weight of a tackifier and (F) 1 to 20 parts by weight of a styrene polymer, characterized in that (B)&plus;(C)&equals;15 to 60 parts by weight, (C)&plus;(D)&gE;2 parts by weight, and (A)/&lsqb;(B)&plus;(C)&rsqb;&equals;0.5 to 3. This composition has excellent adhesion to the styrene resin or a saponified product of the ethylene/vinyl acetate copolymer, and a laminated body of these resins using this composition as an adhesive layer has excellent post-processability.

Adhesive resin composition

Disclosed is a polyethylene resin composition for heavy-duty packaging bag, which has a specific MFR, a specific density and a specific melt tension and which comprises (I) a linear low-density polyethylene resin prepared from ethylene and an .alpha.-olefin of 4 or more carbon atoms and having a specific MFR, a specific molecular weight distribution and a density of 0.900 to 0.918 g/cm.sup.3, (II) a linear medium or high-density polyethylene resin having a density of 0.935 to 0.970 g/cm.sup.3 and (III) a high-pressure low-density polyethylene resin having a density of 0.915 to 0.924 g/cm.sup.3, in a specific ratio of components. Also disclosed is a polyethylene resin film prepared from said composition. The composition is able to provide a film which is excellent in low-temperature properties such as low-temperature drop-bag strength and can be advantageously used for a heavy-duty packaging bag even in a cold district of below-freezing temperature. The polyethylene resin film exerts the above-mentioned effects.

Polyethylene resin composition for heavy-duty packaging bag and

Semiconducting compositions and wires and cables using the same

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Ichihara, Japan

Kouji Kitahara