Tdk Corporation

Mitsubishi Electric Corporation

Kouji Kawamura

Tomonaga Nishikawa

Hidenori Tsutsui

Takeshi Okumura

Tomokazu Ito

Tadashi Watanabe

Naoaki Fujii

Kenji Tanaka

Hiroyuki Akita

Masanori Suzuki

Fumio Watanabe

Hitoshi Ozawa

Satoru Naito

Nobuya Takahashi

Manabu Yamatani

Yosuke Mizutani

Masatoshi Murai

Hirotoshi Yonezawa

Hiromu Sakamoto

Mitsuhiko Endo

Kengo Osada

Takuro Tsuruta

Hiroshi Sagawa

Mitsuo Natori

Disclosed herein is a coil component that includes a first conductor layer having first and third planar spiral coils and second conductor layer having second planar spiral coil. The first planar spiral coil is positioned on an outer peripheral side of the third planar spiral coil. The first planar spiral coil has a pattern width larger than that of the third planar spiral coil. The second planar spiral coil is offset to the third planar spiral coil side in a plan view.

Coil component

Disclosed herein is a coil component that includes first, second, third, and fourth terminal electrodes; a first planar spiral coil formed on a substrate, the first planar spiral coil having an outer peripheral end connected to the first terminal electrode; a second planar spiral coil stacked on the first planar spiral coil through a first insulating layer, the second planar spiral coil having an outer peripheral end connected to the second terminal electrode; and first and second lead-out patterns stacked on the second planar spiral coil through a second insulating layer. The first lead-out pattern connects the third terminal electrode and an inner peripheral end of the first planar spiral coil. The second lead-out pattern connects the fourth terminal electrode and an inner peripheral end of the second planar spiral coil. The second insulating layer is thicker than the first insulating layer.

Disclosed herein is a coil component that includes an element body having first and second magnetic layers and a coil part positioned therebetween, and first and second external terminals formed on the element body. The first external terminal is formed on the mounting surface and the first side surface. The second external terminal is formed on the mounting surface and the second side surface. The first and second external terminals formed on the first and second side surfaces, respectively, have a meander shape.

A coil component includes a plurality of conductor layers constituted of a first conductor layer to a fourth conductor layer that includes a function layer and a coil layer wound around an axis center; and a covering portion that is formed of an insulative resin, integrally covers the plurality of conductor layers, and is interposed between conductor layers adjacent to each other. The coil layer and the function layer of the plurality of conductor layers have substantially the same shape in a plan view. The fourth conductor layer has a connection conductor layer connecting the coil layer and the function layer to each other. A conductor layer having no connection conductor layer among the plurality of conductor layers has a protrusion portion corresponding to the connection conductor layer at a position overlapping the connection conductor layer in a plan view.

Disclosed herein is a coil component that includes a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, and an external terminal. Each of the conductor layers has a coil conductor pattern and an electrode pattern exposed from the coil part. The electrode patterns are connected to each other through a plurality of via conductors penetrating the interlayer insulating layers. At least one of the interlayer insulating layers is exposed from the coil part positioned between the plurality of electrode patterns. The external terminal is formed on the electrode patterns exposed from the coil part so as to avoid an exposed part of the interlayer insulating layer.

Disclosed herein is a coil component that includes a first planar spiral conductor; a second planar spiral conductor laminated on the first planar spiral conductor and wound in an opposite direction to the first planar spiral conductor; a first external terminal electrically connected to an outer peripheral end of the first planar spiral conductor; a second external terminal electrically connected to an outer peripheral end of the second planar spiral conductor; and a third external terminal electrically connected in common to inner peripheral ends of the first and second planar spiral conductors.

Coil component and circuit board in which coil component are embedded

Disclosed herein is a coil component that includes a spiral conductor, a magnetic material layer covering the spiral conductor and having a through hole exposing an end of the spiral conductor, a through-hole conductor embedded in the through hole and has first region and second regions that are exposed from the magnetic material layer, a first conductor layer formed on an upper surface of the magnetic material layer and covering the first region of the through-hole conductor without covering the second region, and a second conductor layer covering the first conductor layer and the second region of the through-hole conductor, wherein the second conductor layer has a lower resistance than the first conductor layer.

Disclosed herein is a coil component that includes first and second magnetic members; a coil layer arranged between the first and second magnetic members, the coil layer including a plurality of conductor layers and a plurality of non-magnetic insulating layers, the conductor layers and the non-magnetic insulating layers being alternately laminated, the conductor layers being connected to each other via through holes formed in the non-magnetic insulating layers to form a coil pattern; a first external terminal covering one end of the coil pattern exposed to at least one of side surfaces of the coil layer without covering the first and second magnetic members; and a second external terminal covering other end of the coil pattern exposed to at least one of the side surfaces of the coil layer without covering the first and second magnetic members.

Coil component, manufacturing method thereof, and circuit board on which coil component are mounted

A thermal trip device in which a bimetal () is heated by overcurrent and performs trip operation of a circuit by curvature of the heated bimetal (), wherein at least one part of the surface of the bimetal () is made to be black or matte black (). Thereby, temperature of the bimetal () can be highly accurately measured using a no-contact thermometer. Furthermore, a temperature measurement part () of the bimetal is provided with a bending part (), and the surface of the bending part is made to be matte black.

Growing community of inventors

Tokyo, Japan

Kouji Kawamura