Sekisui Chemical Co., Ltd.

National University Corporation Kumamoto University

Kouji Ashiba

Rui Zhang

Shoji Nozato

Keigo Oowashi

Hirotaka Ihara

Yuko Kawahara

Masataka Sugimoto

Hiroshi Maenaka

Osamu Inui

Kazuyuki Yahara

Makoto Takafuji

Aki Koukami

Aki Kouma

Shohei Mizuno

Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and a thermally conductive filler, the thermally conductive filler contains boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first content of the boron nitride in 100% by volume of a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second content of the boron nitride in 100% by volume of a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.

Insulating sheet and laminate

Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and further effectively controlling the variation in dielectric breakdown strength, and further effectively increasing the adhesion. A resin material according to the present invention includes first inorganic particles, second inorganic particles, and a binder resin, and a ratio of a compressive strength at 10% compression of the first inorganic particles to a compressive strength at 10% compression of the second inorganic particles is 2.5 or more, the second inorganic particles have a compressive strength at 10% compression of 1.5 N/mmor less, and the second inorganic particles include primary particles having an aspect ratio of 7 or less.

Resin material and laminate

The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate () according to the present invention includes a metal substrate (), an insulating layer () laminated on one surface of the metal substrate (), and a patterned metal layer () laminated on the surface of the insulating layer () on the side opposite to the metal substrate (), the metal layer () is 300 &#x3bc;m or more in thickness, and the insulating layer () includes boron nitride () and an inorganic filler () other than boron nitride.

Laminate and electronic device

An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.

Insulation sheet, laminate, and substrate

Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.

Heat dissipation sheet, method for producing heat dissipation sheet, and laminate

Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.

Resin material, method for producing resin material, and laminate

Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing variation in the adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average aspect ratio of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average aspect ratio of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.

Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing generation of voids. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average major diameter of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average major diameter of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.

Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and effectively controlling the variation in dielectric breakdown strength. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and a 10% K value of the second boron nitride aggregate particles is smaller than a 30% K value of the second boron nitride aggregate particles, and a 30% K value of the second boron nitride aggregate particles is smaller than a 10% K value of the first boron nitride aggregate particles.

Growing community of inventors

Osaka, Japan

Kouji Ashiba