Nitto-Denko Corporation

Kouji Akazawa

Hiroyuki Katayama

Hideyuki Usui

Ichiro Suehiro

Takeshi Matsumura

Takahiro Fukuoka

Fumiteru Asai

Yoshio Nakagawa

Kazuyuki Kiuchi

Tomohiro Kontani

Kohei Yano

Shouji Yamamoto

Noriaki Harada

Tomokazu Takahashi

Toshio Shintani

Kouichi Hashimoto

Yoshinori Yoshida

Tatsuya Kubozono

Syouji Yamamoto

Ryuuichi Kimura

The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which Rand Reach independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R's are the same or different and a plurality of R's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.

Microlens array

To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet

The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life.

Process for producing optical semiconductor device

The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.

Resin sheet for encapsulating optical semiconductor element and optical semiconductor device

A modified polyaluminosiloxane obtained by treating a polyaluminosiloxane with a silane coupling agent represented by the formula (I): wherein each of R, Rand Ris independently an alkyl group or an alkoxy group; X is a methacryloxy group, a glycidoxy group, an amino group, a vinyl group or a mercapto group, with proviso that at least two of R, Rand Rare alkoxy groups. The photosemiconductor element encapsulating material of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

Modified polyaluminosiloxane

The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive layer, the intermediate layer having a storage elastic modulus (G') of 3.0&#xd7;10to 1.0&#xd7;10Pa at 23&#xb0; C. and a storage elastic modulus (G&#x2032;) of 1.0&#xd7;10to 8.0&#xd7;10Pa at 200&#xb0; C.

Re-peelable pressure-sensitive adhesive sheet

Ultraviolet curing pressure-sensitive adhesive sheet

Growing community of inventors

Ibaraki, Japan

Kouji Akazawa