Mitsubishi Plastics, Inc.

Dai Nippon Printing Co., Ltd.

Other

Mitsubishi Chemical Corporation

Kouichirou Taniguchi

Jun Nishioka

Yo Miyashita

Michiko Otsuka

Kazuya Tanaka

Shingetsu Yamada

Shinya Fukuda

Jun Takagi

Takeyoshi Yamada

Masashi Yokogi

Michiaki Fuji

Tomoyuki Nemoto

Haruo Sasaki

Noriyuki Kobayashi

Maiko Suzuki

Ryota Yamamoto

Hideki Sasaki

Hideyasu Miyazaki

Kaoru Nomoto

Seiichi Kubokawa

Motoi Yamashita

Hidetaka Arai

Asami Kitajima

Masashi Ikeda

Singetsu Yamada

Takuya Kitamura

Hideo Yamano

Daiki Tabata

Kouji Kondo

Kumiko Okamoto

Satoshi Kitada

A solar cell encapsulant sheet including a resin layer (S) formed of a resin composition containing an olefine-based resin, wherein the storage elastic modulus at 25&#xb0; C. of the resin layer (S) is 200 MPa or less, at least one surface of the resin layer (S) is the sheet surface of the encapsulant sheet, and the sheet surface satisfies the following requirements (a), (b) and (c): (a) the dynamic friction coefficient on a tempered white glass plate is 1.5 or less, (b) the surface roughness Rzjis is from 0.1 to 50 &#x3bc;m, and (c) the static friction coefficient on a tempered white glass plate is 1.5 or less.

Sealing sheet for solar cell

A solar cell module having a good appearance after lamination and a method for producing such a solar cell module are provided by specifying the combination guideline for encapsulants capable of bettering the appearance after lamination. The solar cell module contains an upper protective material (A), an encapsulant (B) for use on the side of the upper protective material (A), a solar cell device (C), an encapsulant (D) for use on the side of a back sheet (E), and the back sheet (E), wherein the encapsulant (B) and the encapsulant (D) satisfy the following requirement (P), and the production method produces the solar cell module. Requirement (P): The flow beginning temperature (TB) (&#xb0; C.) of the encapsulant (B) and the flow beginning temperature (TD) (&#xb0; C.) of the encapsulant (D), as measured under a load of 1 kgf/cm, have the following relationship: TB&#x2212;TD&#x3e;0 (&#xb0; C.).

Solar battery module and method of manufacture thereof

Provided are a laminate for solar cells, which facilitates production of solar cell modules, which does not require a crosslinking step and which is excellent in transparency, moisture-proofness, sealability and handleability (rigidity), and a solar cell module produced by the use of the laminate. The laminate for solar cells has a resin layer (I)-1 or a resin layer (I)-2 as at least one outermost layer thereof, and has a resin layer (II) that contains an etylene-based polymer (C) satisfying a specific requirement and a nucleating agent (D). The resin layer (I)-1 is a resin layer containing an ethylene/&#x3b1;-olefin random copolymer (A) satisfying a specific requirement, and an ethylene/&#x3b1;-olefin block copolymer (B) satisfying a specific requirement. The resin layer (I)-2 is a resin layer containing a silane-modified etylene-based resin (X).

Laminate for solar cell and solar cell module produced using same

Provided are a solar cell encapsulant material which facilitates production of solar cell modules, which does not require a crosslinking step and which is excellent in heat resistance and others, and a solar cell module produced by the use of the encapsulant material. The solar cell encapsulant material comprises a resin composition (C) that contains an olefin-based polymer (A) satisfying the following requirement (a) and an olefin-based polymer (B) satisfying the following requirement (b). (a) The crystal melting peak temperature of the polymer, as measured at a heating rate of 10&#xb0; C./min in differential scanning calorimetry, is lower than 100&#xb0; C. (b) The extrapolated onset temperature of melting of the polymer, as measured at a heating rate of 10&#xb0; C./min in differential scanning calorimetry, is 100&#xb0; C. or higher.

Solar cell sealing material, and solar cell module prepared by using same

There is provided an encapsulant material for solar cells which facilitates production of a solar cell module and is excellent in flexibility, heat resistance, transparency, etc., and a solar cell module produced using the encapsulant material. The present invention relates to an encapsulant material for solar cells which includes a resin composition (C) containing an ethylene-&#x3b1;-olefin random copolymer (A) capable of satisfying the following condition (a) and an ethylene-&#x3b1;-olefin block copolymer (B) capable of satisfying the following condition (b): (a) a heat of crystal fusion is from 0 to 70 J/g as measured in differential scanning calorimetry at a heating rate of 10&#xb0; C./min; and (b) a crystal fusion peak temperature is 100&#xb0; C. or higher and a heat of crystal fusion is from 5 to 70 J/g as measured in differential scanning calorimetry at a heating rate of 10&#xb0; C./min.

Solar cell sealing material and solar cell module produced using the same

The present invention provides an adsorptive member which is used in a heat exchanger such as an adsorptive heat pump or a humidity control apparatus such as a desiccant system and which is excellent in heat resistance and adhesion between adsorptive particles and a base material. The adsorptive member comprising a base material and an adsorptive material layer formed on the base material,

Adsorptive member and apparatus using the same

A diaphragm for electro-acoustic transducers, especially a diaphragm for speakers, and a film for the diaphragm excellent in the formability and the durability in high-output operation are obtained. A diaphragm for electro-acoustic transducers formed of a film that contains a polybiphenyl ether sulfone resin (A) having a specific repetitive unit or contains it and a crystalline resin (B) such as polyaryl ketone resin; and a film for use for the diaphragm.

Diaphragm for electro-acoustic transducer

The present invention relates to a polycarbonate resin composition (X) which includes a polycarbonate resin (A) and an aromatic polycarbonate resin (B), the polycarbonate resin (A) including a constitutional unit derived from a dihydroxy compound (a) having, as part of the structure thereof, a site represented by the following formula (1) and a constitutional unit derived from a dihydroxy compound (b) of an aliphatic hydrocarbon, wherein the proportion of the constitutional unit derived from the dihydroxy compound (b) of an aliphatic hydrocarbon based on all constitutional units each derived from a dihydroxy compound in the polycarbonate resin (A) is 45% by mole or more. (The case where the site represented by the formula (1) is part of &#x2014;CH&#x2014;O&#x2014;H is omitted.)

Polycarbonate resin composition, and molded object, film, plate, and injection-molded article obtained by molding the same

Diaphragm for electro-accoustic transducer

The present invention provides a heat-shrinkable polyphenylene sulfide-based tube containing a resin composition (A) including a thermoplastic polyphenylene sulfide-based resin (a) as a main constituent, having a difference of 35&#xb0; C. or more between the cold crystallization temperature Tc as measured by a differential scanning calorimetry in accordance with JIS-K7121 and the glass transition temperature Tg measured in the same manner, and having the glass transition temperature Tg between 65&#xb0; C. and 85&#xb0; C.; and the invention provides a component covered with the tube. The heat-shrinkable polyphenylene sulfide-based tube fulfills the characteristics required for a heat-shrinkable tube, such as heat resistance, low-temperature shrinkage characteristics, electrical characteristics, chemical resistance, and electrolytic solution resistance.

Polyphenylene sulfide-based heat-shrinkable tube and component covered with the tube

A polylactic acid-based resin composition comprising: 50-90 mass % of a polylactic acid-based resin (A); and 10-50 mass % of a polyolefin-based resin (B), heat quantity of crystallization of the polyolefin-based resin (B) being 40 J/g or less as measured by using differential scanning calorimeter as measured at a thermal process comprising the steps of: heating up to 200&#xb0; C. at a heating rate of 10&#xb0; C./min; keeping the temperature at 200&#xb0; C. for 5 minutes; and cooling down to the room temperature at a cooling rate of 10&#xb0; C./min. The invention also provides: The composition may be applied, for example, to produce a polylactic acid-based film, a molded product using the film, an elongated film, a heat-shrinkable label, and a container having the heat-shrinkable label.

Polylactic acid-based resin composition, polylactic acid-based film, molded product using the film, elongated film, heat-shrinkable label, and container having the label thereon

A heat-shrinkable polyolefin series laminated film having excellent firmness (stiffness at ordinary temperature) of film, resistance to fingerprint bleaching, shrink finishability, transparency and regeneration additivity, with a small natural shrinkage and accurately separable by specific gravity, can be provided by, in a laminated film provided with a surface layer (I) and an intermediate layer (III), forming the surface layer (I) with a mixed resin of cyclic olefin series resin and a polyethylene series resin (A) with a Tm of 80&#xb0; C. or higher but no greater than 125&#xb0; C. as a main component, and, forming the intermediate layer (III) with a resin composition having as a main component a cyclic olefin series resin, preferably a mixed resin composition of a cyclic olefin series resin and a polyethylene series resin (C) with a Tm exceeding 125&#xb0; C. but no greater than 140&#xb0; C., as a main component.

Heat-shrinkable layered polyolefin film, heat-shrinkable label, and container with the label attached thereto

A heat resistant film comprising total 100 parts by weight of a resin composition comprising at least (A-1) a polyetherimide resin having repeating units of the structural formula (1), (A-2) a polyetherimide resin having repeating units of the structural formula (2), and (B) a polyarylketone resin having a melting peak temperature of 260 degrees C. or higher, and 5 to 50 parts by weight of a filler, wherein a weight ratio of the resin components, [(A-1)+(A-2)]/(B)], ranges from 70/30 to 30/70 and a weight ratio, (A-1)/(A-2), ranges from 70/30 to 30/70. 

Heat resistant film and metal laminate thereof

A film of a resin composition comprising total 100 parts by weight of a crystalline polyarylketone resin (A) and a noncrystalline polyetherimide resin (B), and 5 to 50 parts by weight of a filler, said film satisfies the following relation()&#x3c;()&#x2266;()+20wherein, Tc (A) is a peak temperature of crystallization of the crystalline polyarylketone resin (A),Tc (A+B) is the peak temperature of crystallization of the film, and Tg (B) is a glass transition temperature of the noncrystalline polyetherimide resin (B), each temperature value being measured bu differential scanning calorimetry at a heating rate of 10 degrees C./minute. The film and a metal laminate thereof are suitable for electronics parts.

Polyarlketone resin film and a laminate thereof with metal

A heat resistant resin composition comprising 70 to 30 wt % of a crystalline polyarylketone resin having a peak crystalline melting temperature of 260&deg; C. or higher and 30 to 70 wt % of a noncrystalline polyetherimide resin, wherein said composition has at least 2 peaks of loss tangent (tan &dgr;) between 140&deg; C. and 250&deg; C., determined by dynamic mechanical measurement.

Growing community of inventors

Shiga, Japan

Kouichirou Taniguchi