Disco Corporation

Kouichi Yajima

Toshiaki Takahashi

Kazuhisa Arai

Shinichi Namioka

Masatoshi Nanjo

Masahiko Kitamura

A semiconductor wafer protecting unit which enables a semiconductor wafer to be handled as required, without breakage of the semiconductor wafer, even when the back of the semiconductor wafer is ground to decrease the thickness of the semiconductor wafer markedly; and a semiconductor wafer processing method using such a semiconductor wafer protecting unit. The semiconductor wafer protecting unit is composed of a magnetized tape having one surface with tackiness, and a magnetic substrate having many pores formed at least in a central zone thereof.

Semiconductor wafer protective device and semiconductor wafer treatment method

A method of picking up a plurality of semiconductor chips formed by dividing a semiconductor wafer comprises the step of adhesively holding the plurality of semiconductor chips on an elastic adhesive pad which has innumerable pores in the surface and generates adhesion force when negative pressure is produced by the pores crushed by restoration force generated by elasticity and adhesion, and the step of picking up the semiconductor chips in a state of air in the pores being expanded by heating the elastic adhesive pad which adhesively holds the plurality of semiconductor chips at a predetermined temperature.

Semiconductor chip pick-up method

A method of separating a plate-like workpiece held by adhesion on an elastic adhesive pad from the pad. The elastic adhesive pad has innumerable pores in its surface and generates adhesive force when negative pressure is produced by the pores, after being crushed, by restoration force generated by elasticity and adhesion. The method includes the step of heating the elastic adhesive pad at a predetermined temperature to separate the plate-like workpiece from the elastic adhesive pad by air expanding in the pores.

Growing community of inventors

Tokyo, Japan

Kouichi Yajima