Kayaba Industry Company, Ltd.

Sony Corporation

Ykc Corporation

Kouichi Watanabe

Koichiro Awano

Satoshi Chikamatsu

Takashi Okumura

Isao Furuhashi

A damping valve () resists a flow of fluid from a first fluid chamber () to a second fluid chamber () which are separated by a piston (). A partitioning member (-) partitions an inflow space (A, B) of a passage () in the first fluid chamber (). A spool () decreases a flow cross-sectional area of a flow path from the first fluid chamber () into the inflow space (A, B) according to a differential pressure between the fluid chambers. By ensuring a gap between the outer circumference of the valve disk () and the partitioning member (-) which permanently allows fluid to flow from the first chamber () into the inflow space (A, B), the damping force characteristic in a high speed region of piston displacement can be set independently of the damping force characteristic in other regions.

Damping force generating mechanism for shock absorber

To provide a power steering device for a boat with an outboard motor which helps to realize easy drive with small steering force without taking waterproofness into consideration. A gear device () is provided for driving a link mechanism for turning and steering an outboard motor main body at the rear of the boat body through a cable by a steering wheel (). A steering torque input to the gear device () by the steering wheel () is detected by a torque sensor () to assist-drive the gear devicein the steering direction by an electric motor (), a helical pinion (), and a helical wheel ().

Power steering device for boat with outboard motor

A double-sided printed wiring board includes a base plate having a copper foil laminated on each of the opposite sides thereof. The copper foil-laminated base plate has through-holes extending therethrough, and at least one of the through-holes is internally plated for providing a through-via-hole into which a resin filler is provided and solidified. A closed through-via-hole is thus obtained. The copper foil-laminated base plate including the closed through-via-hole is copper-plated, and a particular wiring pattern is formed thereon. A chip land is formed in alignment with the closed through-via-hole.

Growing community of inventors

Tokyo, Japan

Kouichi Watanabe