Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Kouichi Tsuyama

Naoyuki Urasaki

Akishi Nakaso

Akinari Kida

Shuichi Hatakeyama

Atsushi Nishimura

Hiroshi Nomura

Kiyoshi Hasegawa

Tadashi Isono

Atsushi Suzunaga

Hiroshi Shimizu

Hisashige Kanbara

Yoshiyuki Tsuru

Shigeharu Arike

Kazuhito Kobayashi

Daisuke Fujimoto

Toshiro Okamura

Yoshihito Kikuhara

Nobuyuki Ogawa

Yorio Iwasaki

Hajime Nakayama

Kazuhisa Otsuka

Minoru Tosaka

Susumu Naoyuki

Norio Okano

Yutaka Taniguchi

Toyoki Ito

Toshirou Okamura

Kyosuke Suzuki

Hisaji Kobori

Wataru Shimizu

Masami Negishi

Mituo Teppozuka

Tadayasu Fujieda

Kousuke Takada

An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.

Engraved plate and substrate with conductor layer pattern using the same

A current protector comprising an organic resin-made insulating substrate, a pair of terminals formed at both ends of the insulating substrate, and an electrical conductor electrically connecting the terminals and having a thickness of 3-8 .mu.m and formed in or on the insulating substrate, is excellent in suppressing ignition and smoking at the time of blowing, and can be improved in clearing characteristics by various modifications.

Current protector

Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive. The assembly is then cut apart into individual chip type electrostatic protective devices by cutting through each of the holes for interconnection so as to define terminals for interconnection.

Electrostatic protective device and method for fabricating same

A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Process for producing multilayer printed circuit board for wire bonding

Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive. The assembly is then cut apart into individual chip type electrostatic protective device by cutting through each of the holes for interconnection so as to define terminals for interconnection.

Electrostatic protective device

A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

Metal foil for printed wiring board and production thereof

A process for producing a wiring board involves laminating a metal foil on both sides of an insulating substrate not completely cured, followed by pressing with heating; drilling holes in the resulting laminate for connecting circuits therein; removing portions of the metal foils in narrow areas around the holes to form hollow portions in the metal foils; and filling a flowable electroconductive substance in the holes and the hollow portions.

Process for producing a printed wiring board

A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said inner layer circuit substrate comprising an insulating layer and metal foil layers formed on both sides of said insulating layer, at least one inner layer circuit substrate or said outer circuit layers or both having hollow portions in the metal foil layer filled with an electroconductive substance, said wiring board having one or more through-holes at least in the hollow portions and filled with the electroconductive substance, has high reliability and a high wiring density.

Printed wiring board and production thereof

Crystallized glass roughened by using a roughening solution having a larger dissolving rate as to a non-crystalline phase compared with a crystalline phase, followed by metallizing by electroless plating shows strong adhesive strength between the crystallized glass substrate and the plated film.

Process for metallizing glass surface

Growing community of inventors

Shimodate, Japan

Kouichi Tsuyama