Tokyo Ohka Kogyo Co., Ltd.

Hitachi, Ltd.

Nec Corporation

Morinaga Milk Industry Co., Ltd.

Hitachi Information Technology Co., Ltd.

Kouichi Takahashi

Toshimasa Nakayama

Hidekatsu Kohara

Tetsuya Kato

Takahiro Daikoku

Kousuke Doi

Jun Koshiyama

Kenichi Kasai

Satoshi Niikura

Nobuo Tokutake

Hirotoshi Hayasawa

Takeshi Yamaguchi

Takayuki Uda

Toshitada Netsu

Hiroshi Hosoda

Yosuke Shimizu

Kazuyoshi Nanba

Osamu Maruyama

Kunio Niwa

Takashi Simizu

Kouji Sayama

Taizo Nagura

Tsutom Aritsuka

Takahiko Matsushita

A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a framecompatible with a wiring boardin thermal expansion rate is fixed with solderto the face of the wiring boardfor mounting semiconductor devices; a rubber O-ringis placed between the upper face of the frameand the under face of the circumference of an air-cooled: heat sink; the plastic membermaking possible relative sliding is placed between the upper face of the circumference of the heat sinkand the upper frame; the upper face of a plastic memberis restrained with the inside middle stage of an upper frame; and the lower part of the upper frameand the frameare fastened together with bolts

Sealing structure for multi-chip module

A method of evaluating a program in which a second program is inserted into an instruction processing of a first program, includes the steps of: latching an address value of a stack pointer when executing an instruction for calling the second program; comparing the address value of the stack pointer held with an address value of a stack pointer during a subsequent instruction execution; and when they are coincident with each other, judging the termination of execution of the second program.

Method and device for evaluating a program

Lactose-containing food composition for infants

Proposed is an alkali-soluble, positive-working photo-sensitive resin composition which can be used as a material for forming a finely patterned resist layer on the surface of a metallic substrate such as tantalum to exhibit excellent adhesion of the patterned resist layer to the substrate surface. The composition comprises, in addition to a novolac resin as a film-forming agent and a naphthoquinone diazide group-containing compound as a photosensitizer, an aromatic compound having two benzene rings and at least five phenolic hydroxy groups in a molecule such as pentahydroxy and hexahydroxy benzophenone compounds as an adhesion improver.

Article utilizing quinone diazide resist layer on tantalum substrate

A positive-working photoresist composition comprising a cresol novolac resin as the film-forming agent and a quinonediazido group-containing compound as the photosensitizing agent is admixed with a limited amount of a hydroxyalkyl-substituted pyridine compound so that great improvements can be obtained in the adhesive bonding of the resist layer to the substrate surface and in the stability of the composition by storage still without the problem due to the sublimed material from the resist layer during the patterning process.

Positive-working quinonediazide photoresist composition containing

Proposed is an alkali-soluble, positive-working photosensitive resin composition which can be used as a material for forming a finely patterned resist layer on the surface of a metallic substrate such as tantalum to exhibit excellent adhesion of the patterned resist layer to the substrate surface. The composition comprises, in addition to a novolac resin as a film-forming agent and a naphthoquinone diazide group-containing compound as a photosensitizer, an aromatic compound having two benzene rings and at least five phenolic hydroxy groups in a molecule such as pentahydroxy and hexahydroxy benzophenone compounds as an adhesion improver.

Method for forming positive patterned resist layer on tantalum substrate

Proposed is a positive-working photosensitive resin composition suitable as a photoresist in the photolithographic patterning work for the manufacture of, for example, semiconductor devices having excellent storage stability and capable of giving a patterned resist layer having excellent contrast of the images, orthogonality of the cross sectional profile of line patterns and heat resistance along with a satisfactorily high photosensitivity and large focusing latitude. The composition comprises, in admixture with an alkali-soluble novolac resin as a film-forming agent, a photosensitizing agent which is an esterification product of a specific tris(hydroxyphenyl) methane compound of which two of the hydroxyphenyl groups each have a cyclohexyl group bonded thereto at a specified position with at least one naphthoquinone-1,2-diazide sulfonyl group as the esterifying group.

Positive working photosensitive resin composition containing

Growing community of inventors

Sagamihara, Japan

Kouichi Takahashi