Kobe Steel, Ltd.

Kouichi Taira

Yasushi Masago

Ryoichi Ozaki

In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu&#x2014;Sn alloy layer, and a Sn layer which are deposited in this order is formed on a surface of a base material made of copper or a copper alloy. An average thickness of the Ni layer is 0.1 to 1.0 &#x3bc;m, an average thickness of the Cu&#x2014;Sn alloy layer is 0.55 to 1.0 &#x3bc;m, and an average thickness of the Sn layer is 0.2 to 1.0 &#x3bc;m. The Cu&#x2014;Sn alloy layer includes Cu&#x2014;Sn alloy layers having two compositions, a portion thereof in contact with the Ni layer is formed of an &#x3b5;-phase having an average thickness of 0.5 to 0.95 &#x3bc;m, and a portion thereof in contact with the Sn layer is formed of a &#x3b7;-phase having an average thickness of 0.05 to 0.2 &#x3bc;m.

Sn-plated copper or Sn-plated copper alloy having excellent heat resistance and manufacturing method thereof

A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu&#x2014;Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer is smoothed by a reflowing process. The terminal has an engaging part and a solder-bonding part, and the surface of a part of the base material corresponding to the engaging part has a surface roughness higher than that of the surface of the base material corresponding to the solder-bonding part. The engaging part has a low frictional property and the solder-bonding part has improved solder wettability.

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Shimonoseki, Japan

Kouichi Taira