Shin-etsu Handotai Co., Ltd.

Kouichi Okamura

Hisashi Masumura

Fumio Suzuki

Kouzi Morita

Naotaka Toyama

Kouichi Tanaka

Noboru Tamai

The present invention is a workpiece holder for polishing comprising at least a workpiece holder body having multiple perforated holes for holding a workpiece by vacuum adsorption and a back plate disposed on the back side of the body, which is provided with temperature controlling means or cooling means for the holder body. Thus, there is provided a workpiece holder for polishing, a polishing apparatus and a polishing method, which can provide a workpiece having good flatness by suppressing thermal deformation of the workpiece holder body and deformation of a resin film coated on the workpiece holding surface without degrading flatness of a workpiece held on the workpiece holder in the polishing of the workpiece, even when the number of polishing operation increases.

Workpiece holder for polishing, polishing apparatus and polishing method

A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has grooves for vacuum, wherein the holder back plate is composed of a synthetic resin and has an Asker C hardness of 70 or higher but lower than 98, and an apparatus for polishing a workpiece and a method for polishing a workpiece utilizing it. By improving the material of holder back plate of a workpiece holder for polishing that holds a workpiece by vacuum suction to enhance sealing with the holder body, thereby developing such a holder back plate that should not transfer deformation of the holder body to the workpiece surface, even if polishing agent slurry is introduced and solidified, to provide a workpiece holder for polishing having a workpiece holding surface of high precision, an apparatus for polishing a workpiece and a method for polishing a workpiece.

Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece

There is disclosed a method of processing a work comprising polishing a work holding surface of a work holding plate by contacting and rubbing a work holding surface of a work holding plate with a polishing pad attached on a polishing turn table with providing polishing agent thereto, holding a wafer W on said work holding surface by vacuum-holding, and contacting and rubbing the wafer W with said polishing pad to polish the work with providing polishing agent wherein temperature of the polishing agent or the polishing turn table is controlled by temperature controller so that a temperature of said work holding surface when polishing said work holding plate and a temperature of said work holding surface when polishing the wafer w are controlled to be the same. Degradation of flatness due to thermal influence when polishing the holding plate and polishing the wafer can be prevented in a method of processing comprising polishing the work holding surface of the work holding plate to conform with the deformed shape of the polishing pad, holding a work with the work holding surface, and polishing the work.

Method and apparatus for polishing work

By improving the material of workpiece holder body of a workpiece holder for polishing that holds a workpiece by vacuum adsorption, and the material of resin film for coating a workpiece holding surface of the holder, and developing a method for coating the surface with a resin, which does not cause blocking of perforated holes of the holder body with the resin during the resin coating process, there are provided a workpiece holder for polishing having a workpiece holding surface of high precision, and a method for producing it. According to the present invention, there are provided a workpiece holder for polishing having a workpiece holder body provided with multiple perforated holes for holding a workpiece by vacuum adsorption, wherein a holding surface of the holder body is coated with a coating film formed by applying a thermosetting resin on the holding surface and curing it with heating, and a surface of the coating film is polished, and a method for producing it.

Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus

A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (,) is supported by a grooved surface of a turn table receiving member (,), the grooved surface being provided with grooves (,) in a straight direction, a work (W) is pressed against a polishing pad (,) adhered to the turn table (,) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (,).

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Nakakubiki-gun, Japan

Kouichi Okamura